ADC084S101CIMM Datasheet, PDF (3/27 Pages) Texas Instruments – ADC084S101 4 Channel, 500 ksps to 1 Msps, 8-Bit A/D Converter

ADC084S101
www.ti.com
SNAS285D – APRIL 2005 – REVISED MARCH 2013
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
Absolute Maximum Ratings^(1)(2)(3)
Supply Voltage V_A
Voltage on Any Pin to GND
Input Current at Any Pin⁽⁴⁾
Package Input Current⁽⁴⁾
Power Consumption at T_A = 25°C
ESD Susceptibility⁽⁶⁾
Junction Temperature
Storage Temperature
Human Body Model
Machine Model
−0.3V to 6.5V
−0.3V to V_A +0.3V
±10 mA
±20 mA
See ⁽⁵⁾
2500V
250V
+150°C
−65°C to +150°C
(1) Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for
which the device is functional, but do not ensure specific performance limits. For guaranteed specifications and test conditions, see the
Electrical Characteristics. The specified specifications apply only for the test conditions listed. Some performance characteristics may
degrade when the device is not operated under the listed test conditions.
(2) All voltages are measured with respect to GND = 0V, unless otherwise specified.
(3) If Military/Aerospace specified devices are required, please contact the Texas Instruments Sales Office/ Distributors for availability and
specifications.
(4) When the input voltage at any pin exceeds the power supply (that is, V_IN < GND or V_IN > V_A), the current at that pin should be limited to
10 mA. The 20 mA maximum package input current rating limits the number of pins that can safely exceed the power supplies with an
input current of 10 mA to two. The Absolute Maximum Rating specification does not apply to the V_A pin. The current into the V_A pin is
limited by the Analog Supply Voltage specification.
(5) The absolute maximum junction temperature (T_Jmax) for this device is 150°C. The maximum allowable power dissipation is dictated by
T_Jmax, the junction-to-ambient thermal resistance (θ_JA), and the ambient temperature (T_A), and can be calculated using the formula
P_DMAX = (T_Jmax − T_A)/θ_JA. The values for maximum power dissipation listed above will be reached only when the device is operated in
a severe fault condition (e.g. when input or output pins are driven beyond the power supply voltages, or the power supply polarity is
reversed). Obviously, such conditions should always be avoided.
(6) Human body model is 100 pF capacitor discharged through a 1.5 kΩ resistor. Machine model is 220 pF discharged through zero ohms.
Operating Ratings⁽¹⁾⁽²⁾
Operating Temperature Range
V_A Supply Voltage
Digital Input Pins Voltage Range
Clock Frequency
−40°C ≤ T_A ≤ +85°C
+2.7V to +5.25V
−0.3V to V_A
50 kHz to 16 MHz
Analog Input Voltage
0V to V_A
(1) Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for
which the device is functional, but do not ensure specific performance limits. For guaranteed specifications and test conditions, see the
Electrical Characteristics. The specified specifications apply only for the test conditions listed. Some performance characteristics may
degrade when the device is not operated under the listed test conditions.
(2) All voltages are measured with respect to GND = 0V, unless otherwise specified.
Package Thermal Resistance⁽¹⁾
Package
10-lead VSSOP
θ_JA
190°C / W
(1) Soldering process must comply with Reflow Temperature Profile specifications. Refer to www.ti.com/packaging. Reflow temperature
profiles are different for lead-free and non-lead-free packages.
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