CC2540T Datasheet, PDF (29/37 Pages) Texas Instruments – Extended Industrial Temperature Bluetooth Smart Wireless MCU

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CC2540T
SWRS172A – JULY 2014 – REVISED NOVEMBER 2015
7.4 Low-Power RF eNewsletter
The Low-Power RF eNewsletter keeps the user up-to-date on new products, news releases, developers’
news, and other news and events associated with low-power RF products from TI. The Low-Power RF
eNewsletter articles include links to get more online information.
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7.5 Trademarks
SmartRF, SimpleLink, E2E are trademarks of Texas Instruments.
Bluetooth is a registered trademark of Bluetooth SIG, Inc.
IAR Embedded Workbench is a trademark of IAR Systems AB.
ZigBee is a registered trademark of ZigBee Alliance, Inc.
All other trademarks are the property of their respective owners.
7.6 Electrostatic Discharge Caution
This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with
appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more
susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.
7.7 Export Control Notice
Recipient agrees to not knowingly export or re-export, directly or indirectly, any product or technical data
(as defined by the U.S., EU, and other Export Administration Regulations) including software, or any
controlled product restricted by other applicable national regulations, received from disclosing party under
nondisclosure obligations (if any), or any direct product of such technology, to any destination to which
such export or re-export is restricted or prohibited by U.S. or other applicable laws, without obtaining prior
authorization from U.S. Department of Commerce and other competent Government authorities to the
extent required by those laws.
7.8 Glossary
TI Glossary This glossary lists and explains terms, acronyms, and definitions.
8 Mechanical Packaging and Orderable Information
8.1 Packaging Information
The following pages include mechanical packaging and orderable information. This information is the most
current data available for the designated devices. This data is subject to change without notice and
revision of this document. For browser-based versions of this data sheet, refer to the left-hand navigation.
Copyright © 2014–2015, Texas Instruments Incorporated
Mechanical Packaging and Orderable Information
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