LP5910_17 Datasheet, PDF (28/29 Pages) Texas Instruments – 300-mA Low-Noise, Low-IQ LDO

YKA0004
EXAMPLE STENCIL DESIGN
DSBGA - 0.4 mm max height
DIE SIZE BALL GRID ARRAY
4X ( 0.21)
1
A
(0.35)
TYP
B
(0.35) TYP
(R0.05) TYP
2
SYMM
METAL
TYP
SYMM
SOLDER PASTE EXAMPLE
BASED ON 0.1 mm THICK STENCIL
SCALE:40X
NOTES: (continued)
4. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release.
4221909/A 02/2015
www.ti.com