TPD3S714-Q1 Datasheet, PDF (25/29 Pages) Texas Instruments – Automotive USB 2.0 Interface Protection

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DBQ0016A
TPD3S714-Q1
SLVSCG4 – JANUARY 2016
EXAMPLE BOARD LAYOUT
SSOP - 1.75 mm max height
SHRINK SMALL-OUTLINE PACKAGE
16X (.063)
[1.6]
1
16X (.016 )
[0.41]
SYMM
SEE
DETAILS
16
14X (.0250 )
[0.635]
8
9
(.213)
[5.4]
LAND PATTERN EXAMPLE
SCALE:8X
METAL
SOLDER MASK
OPENING
SOLDER MASK
OPENING
METAL
.002 MAX
[0.05]
ALL AROUND
NON SOLDER MASK
DEFINED
SOLDER MASK DETAILS
.002 MIN
[0.05]
ALL AROUND
SOLDER MASK
DEFINED
NOTES: (continued)
6. Publication IPC-7351 may have alternate designs.
7. Solder mask tolerances between and around signal pads can vary based on board fabrication site.
4214846/A 03/2014
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