TPS82140 Datasheet, PDF (24/26 Pages) Texas Instruments – 17-V Input 2-A Step-Down Converter MicroSiP Module with Integrated Inductor

TPS82140
SLVSDN3 – JUNE 2017
SIL0008D
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EXAMPLE STENCIL DESIGN
MicroSiP ^TM - 1.53 mm max height
MICRO SYSTEM IN PACKAGE
8X (0.5)
1
8X (0.4)
METAL
TYP
SYMM
(1.04)
SOLDER MASK EDGE
(R0.05) TYP
8
(0.85)
(1.05)
6X (0.65)
4
5
SYMM
(2.1)
SOLDER PASTE EXAMPLE
BASED ON 0.125 mm THICK STENCIL
EXPOSED PAD
85% PRINTED SOLDER COVERAGE BY AREA
SCALE:30X
4221520/A 07/2015
NOTES: (continued)
6. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate
design recommendations.
24
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