THS6012_16 Datasheet, PDF (24/37 Pages) Texas Instruments – 500-mA DUAL DIFFERENTIAL LINE DRIVER

THS6012
SLOS226F – SEPTEMBER 1998 – REVISED JUNE 2012
www.ti.com
reflow operation as any standard surface-mount component. This results in a part that is properly installed.
0.080
0.026
0.476
0.120
0.1025
0.024
0.085
0.178
0.450
0.0165
.039
0.021
PowerPAD and via placement
pad area (0.085 x 0.120) with 15
vias (Via diameter = 0.013)
0.026
Vias should go through the board connecting the top layer
PowerPad to any and all ground planes. (The larger the ground
plane, the larger the area to distribute the heat.) Solder resist should
be used on the bottom side ground plane in order to prevent wicking
of the solder through the vias during the reflow process.
All Units in Inches
Figure 45. PowerPAD PCB Etch and Via Pattern
The actual thermal performance achieved with the THS6012 in its PowerPAD package depends on the
application. In the previous example, if the size of the internal ground plane is approximately 3 inches × 3 inches,
then the expected thermal coefficient, Θ_JA, is about 21.5°C/W. For a givenΘ _JA, the maximum power dissipation
is shown in Figure 46 and is calculated by the following formula:
ǒ Ǔ PD +
TMAX–TA
q_JA
Where:
P_D = Maximum power dissipation of THS6012 (watts)
T_MAX = Absolute maximum junction temperature (150°C)
T_A = Free-ambient air temperature (°C)
θ_JA = θ_JC + θ_CA
θ_JC = Thermal coefficient from junction to case (0.37°C/W)
θ_CA = Thermal coefficient from case to ambient
More complete details of the PowerPAD installation process and thermal management techniques can be found
in the Texas Instruments Technical Brief, PowerPAD Thermally Enhanced Package. This document can be found
at the TI web site (www.ti.com) by searching on the key word PowerPAD. The document can also be ordered
through your local TI sales office. Refer to literature number SLMA002 when ordering.
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