LM3886 Datasheet, PDF (24/31 Pages) National Semiconductor (TI) – Overture TM Audio Power Amplifier Series High-Performance 68W Audio Power Amplifier w/Mute

LM3886
SNAS091C – MAY 1999 – REVISED MARCH 2013
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for which the amplifier is operational. Note that the specifications are not specified over the full common-
mode voltage range unless specifically stated.
Common-Mode Rejection: The ratio of the input common-mode voltage range to the peak-to-peak change in
input offset voltage over this range.
Power Supply Rejection: The ratio of the change in input offset voltage to the change in power supply voltages
producing it.
Quiescent Supply Current: The current required from the power supply to operate the amplifier with no load
and the output voltage and current at zero.
Slew Rate: The internally limited rate of change in output voltage with a large amplitude step function applied to
the input.
Class B Amplifier: The most common type of audio power amplifier that consists of two output devices each of
which conducts for 180° of the input cycle. The LM3886 is a Quasi-AB type amplifier.
Crossover Distortion: Distortion caused in the output stage of a class B amplifier. It can result from inadequate
bias current providing a dead zone where the output does not respond to the input as the input cycle goes
through its zero crossing point. Also for ICs an inadequate frequency response of the output PNP device
can cause a turn-on delay giving crossover distortion on the negative going transition through zero
crossing at the higher audio frequencies.
THD + N: Total Harmonic Distortion plus Noise refers to the measurement technique in which the fundamental
component is removed by a bandreject (notch) filter and all remaining energy is measured including
harmonics and noise.
Signal-to-Noise Ratio: The ratio of a system's output signal level to the system's output noise level obtained in
the absence of a signal. The output reference signal is either specified or measured at a specified
distortion level.
Continuous Average Output Power: The minimum sine wave continuous average power output in watts (or
dBW) that can be delivered into the rated load, over the rated bandwidth, at the rated maximum total
harmonic distortion
Music Power: A measurement of the peak output power capability of an amplifier with either a signal duration
sufficiently short that the amplifier power supply does not sag during the measurement, or when high
quality external power supplies are used. This measurement (an IHF standard) assumes that with normal
music program material the amplifier power supplies will sag insignificantly.
Peak Power: Most commonly referred to as the power output capability of an amplifier that can be delivered to
the load; specified by the part's maximum voltage swing.
Headroom: The margin between an actual signal operating level (usually the power rating of the amplifier with
particular supply voltages, a rated load value, and a rated THD + N figure) and the level just before
clipping distortion occurs, expressed in decibels.
Large Signal Voltage Gain: The ratio of the output voltage swing to the differential input voltage required to
drive the output from zero to either swing limit. The output swing limit is the supply voltage less a specified
quasi-saturation voltage. A pulse of short enough duration to minimize thermal effects is used as a
measurement signal.
Output-Current Limit: The output current with a fixed output voltage and a large input overdrive. The limiting
current drops with time once SPiKe protection circuitry is activated.
Output Saturation Threshold (Clipping Point): The output swing limit for a specified input drive beyond that
required for zero output. It is measured with respect to the supply to which the output is swinging.
Output Resistance: The ratio of the change in output voltage to the change in output current with the output
around zero.
Power Dissipation Rating: The power that can be dissipated for a specified time interval without activating the
protection circuitry. For time intervals in excess of 100 ms, dissipation capability is determined by heat
sinking of the IC package rather than by the IC itself.
Thermal Resistance: The peak, junction-temperature rise, per unit of internal power dissipation (units in °C/W),
above the case temperature as measured at the center of the package bottom.
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