TPA0202_16 Datasheet, PDF (23/49 Pages) Texas Instruments – 2-W STEREO AUDIO POWER AMPLIFIER

TPA0202
2-W STEREO AUDIO POWER AMPLIFIER
SLOS205B – FEBRUARY 1998 – REVISED DECEMBER 2000
THERMAL INFORMATION
The thermally enhanced PWP package is based on the 24-pin TSSOP, but includes a thermal pad (see Figure 58)
to provide an effective thermal contact between the IC and the PWB.
Traditionally, surface-mount and power have been mutually exclusive terms. A variety of scaled-down TO-220-type
packages have leads formed as gull wings to make them applicable for surface-mount applications. These packages,
however, have only two shortcomings: they do not address the very low profile requirements (< 2 mm) of many of
today’s advanced systems, and they do not offer a terminal-count high enough to accommodate increasing
integration. On the other hand, traditional low-power surface-mount packages require power-dissipation derating that
severely limits the usable range of many high-performance analog circuits.
The PowerPAD package (thermally enhanced TSSOP) combines fine-pitch surface-mount technology with thermal
performance comparable to much larger power packages.
The PowerPAD package is designed to optimize the heat transfer to the PWB. Because of the very small size and
limited mass of a TSSOP package, thermal enhancement is achieved by improving the thermal conduction paths that
remove heat from the component. The thermal pad is formed using a patented lead-frame design and manufacturing
technique to provide a direct connection to the heat-generating IC. When this pad is soldered or otherwise thermally
coupled to an external heat dissipator, high power dissipation in the ultra-thin, fine-pitch, surface-mount package can
be reliably achieved.
DIE
Side View (a)
DIE
End View (b)
Thermal
Pad
Bottom View (c)
Figure 58. Views of Thermally Enhanced PWP Package
• POST OFFICE BOX 655303 DALLAS, TEXAS 75265
23