THS7319_14 Datasheet, PDF (23/34 Pages) Texas Instruments – 3-Channel, Very Low Power Video Amplifiers with EDTV Filters and 6-dB Gain

THS7319
www.ti.com.............................................................................................................................................................. SBOS468A – JUNE 2009 – REVISED JULY 2009
PRINTED WIRING BOARD (PWB) DESIGN GUIDE
When designing the pad size for the MicrostarCSP, it
is recommended that the layout use a non-solder
mask defined (NSMD) landing pad. With this method,
the solder mask opening is made larger than the
desired land area, and the opening size is defined by
the copper pad width. Figure 53 and Table 2 define
the land pattern recommendations. Figure 54 and
Table 3 show a trace width example.
Copper Trace
Width
Solder Mask Thickness
Solder Pad Width
Solder Mask Opening
Copper Trace Thickness
Figure 53. Land Pattern Recommendations
SOLDER PAD
Non-solder mask defined
(NSMD)
Table 2. Definitions for Figure 53
COPPER PAD
200 µm to 275 µm
SOLDER MASK
OPENING
Copper pad + 50µm
STENCIL OPENING
250 µm × 250 µm square
(rounded corners)
STENCIL THICKNESS
100 µm
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