THS3122 Datasheet, PDF (23/43 Pages) Texas Instruments – LOW-NOISE, HIGH-SPEED, 450 mA CURRENT FEEDBACK AMPLIFIERS

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THS3122, THS3125
SLOS382E – SEPTEMBER 2001 – REVISED MAY 2015
Layout Guidelines (continued)
10.1.2 PowerPAD Design Considerations
The THS3125 and THS3122 are available in a thermally-enhanced PowerPAD family of packages. These
packages are constructed using a downset leadframe upon which the die is mounted [see Figure 48(a) and
Figure 48(b)]. This arrangement results in the lead frame being exposed as a thermal pad on the underside of
the package [see Figure 48(c)]. Because this thermal pad has direct thermal contact with the die, excellent
thermal performance can be achieved by providing a good thermal path away from the thermal pad. Note that
devices such as the THS312x have no electrical connection between the PowerPAD and the die.
DIE
(a) Side View
Thermal
Pad
DIE
(b) End View
(c) Bottom View
Figure 48. Views Of Thermally-Enhanced Package
The PowerPAD package allows for both assembly and thermal management in one manufacturing operation.
During the surface-mount solder operation (when the leads are being soldered), the thermal pad can also be
soldered to a copper area underneath the package. Through the use of thermal paths within this copper area,
heat can be conducted away from the package into either a ground plane or other heat dissipating device.
The PowerPAD package represents a breakthrough in combining the small area and ease of assembly of
surface mount with the, heretofore, awkward mechanical methods of heatsinking.
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