OPA1662-Q1_16 Datasheet, PDF (23/33 Pages) Texas Instruments – Operational Amplifier

www.ti.com
11.2 Layout Example
OPA1662-Q1
SLOS805C – JULY 2012 – REVISED AUGUST 2016
1
8
0.1 PF
2
7
3
6
4
5
0.1 PF
GND plan
Figure 52. Layout Recommendation
11.3 Power Dissipation
The OPA1662-Q1 op amp is capable of driving 2-kΩ loads with a power-supply voltage up to ±18 V and full
operating temperature range. Internal power dissipation increases when operating at high supply voltages.
Copper leadframe construction used in the OPA1662-Q1 op amp improves heat dissipation compared to
conventional materials. Circuit board layout can also help minimize junction temperature rise. Wide copper traces
help dissipate the heat by acting as an additional heat sink. Temperature rise can be further minimized by
soldering the devices to the circuit board rather than using a socket.
Copyright © 2012–2016, Texas Instruments Incorporated
Product Folder Links: OPA1662-Q1
Submit Documentation Feedback
23