TPS727_15 Datasheet, PDF (22/36 Pages) Texas Instruments – Ultralow IQ Fast Transient Response RF Low-Dropout Linear Regulator

TPS727
SBVS128F – JUNE 2009 – REVISED DECEMBER 2015
11 Device and Documentation Support
www.ti.com
11.1 Documentation Support
11.1.1 Related Documentation
Application report SLAA414, LDO PSRR Measurement Simplified.
Application report SLAA412, LDO Noise Demystified.
User guide SLVU323, TPS727xxYFF EVM
User guide SLVU325, TPS727xxDSE EVM
11.1.2 Device Nomenclature
PRODUCT
TPS727xxx yyy z
Table 1. Device Nomenclature⁽¹⁾
V_OUT ⁽²⁾
XXX is the nominal output voltage.
YYY is package designator.
Z is package tape and reel quantity (R = 3000, T = 250).
(1) For the most current package and ordering information see the Package Option Addendum at the end of this document, or visit the
device product folder at www.ti.com.
(2) Output voltages from 0.9 V to 5.0 V in 50-mV increments are available through the use of innovative factory EEPROM programming;
minimum order quantities may apply. Contact factory for details and availability.
11.2 Community Resources
The following links connect to TI community resources. Linked contents are provided "AS IS" by the respective
contributors. They do not constitute TI specifications and do not necessarily reflect TI's views; see TI's Terms of
Use.
TI E2E™ Online Community TI's Engineer-to-Engineer (E2E) Community. Created to foster collaboration
among engineers. At e2e.ti.com, you can ask questions, share knowledge, explore ideas and help
solve problems with fellow engineers.
Design Support TI's Design Support Quickly find helpful E2E forums along with design support tools and
contact information for technical support.
11.3 Trademarks
E2E is a trademark of Texas Instruments.
Bluetooth is a registered trademark of Bluetooth SIG.
Zigbee is a registered trademark of Zigbee Alliance.
All other trademarks are the property of their respective owners.
11.4 Electrostatic Discharge Caution
This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with
appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more
susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.
11.5 Glossary
SLYZ022 — TI Glossary.
This glossary lists and explains terms, acronyms, and definitions.
12 Mechanical, Packaging, and Orderable Information
The following pages include mechanical packaging and orderable information. This information is the most
current data available for the designated devices. This data is subject to change without notice and revision of
this document. For browser-based versions of this data sheet, refer to the left-hand navigation.
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