THS4631_14 Datasheet, PDF (22/35 Pages) Texas Instruments – HIGH-VOLTAGE, HIGH SLEW RATE, WIDEBAND FET-INPUT OPERATIONAL AMPLIFIER

PACKAGE OPTION ADDENDUM
www.ti.com
2-Aug-2011
PACKAGING INFORMATION
Orderable Device
THS4631D
THS4631DDA
THS4631DE4
THS4631DGN
THS4631DGNG4
THS4631DGNR
THS4631DGNRG4
THS4631DR
THS4631DRE4
THS4631DRG4
Status ^{(1) Package Type Package}
Drawing
ACTIVE
SOIC
D
Pins
8
Package Qty
75
ACTIVE SO PowerPAD DDA
8
75
ACTIVE
SOIC
D
8
75
ACTIVE
MSOP-
DGN
8
PowerPAD
ACTIVE
MSOP-
DGN
8
PowerPAD
ACTIVE
MSOP-
DGN
8
PowerPAD
ACTIVE
MSOP-
DGN
8
PowerPAD
ACTIVE
SOIC
D
8
80
80
2500
2500
2500
ACTIVE
SOIC
D
8
2500
ACTIVE
SOIC
D
8
Eco Plan ⁽²⁾
Green (RoHS
& no Sb/Br)
Green (RoHS
& no Sb/Br)
Green (RoHS
& no Sb/Br)
Green (RoHS
& no Sb/Br)
Green (RoHS
& no Sb/Br)
Green (RoHS
& no Sb/Br)
Green (RoHS
& no Sb/Br)
Green (RoHS
& no Sb/Br)
Green (RoHS
& no Sb/Br)
TBD
Lead/
Ball Finish
MSL Peak Temp ⁽³⁾
CU NIPDAU Level-2-260C-1 YEAR
CU SN Level-2-260C-1 YEAR
CU NIPDAU Level-2-260C-1 YEAR
CU NIPDAU Level-1-260C-UNLIM
CU NIPDAU Level-1-260C-UNLIM
CU NIPDAU Level-1-260C-UNLIM
CU NIPDAU Level-1-260C-UNLIM
CU NIPDAU Level-2-260C-1 YEAR
CU NIPDAU Level-2-260C-1 YEAR
Call TI Call TI
(1) _{The marketing status values are defined as follows:}
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
Samples
(Requires Login)
(2) _{Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability}
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
Addendum-Page 1