OPA336_17 Datasheet, PDF (21/27 Pages) Texas Instruments – SINGLE-SUPPLY, microPower CMOS OPERATIONAL AMPLIFIERS microAmplifier Series

DBQ0016A
EXAMPLE STENCIL DESIGN
SSOP - 1.75 mm max height
SHRINK SMALL-OUTLINE PACKAGE
16X (.063)
[1.6]
1
16X (.016 )
[0.41]
SYMM
16
SYMM
14X (.0250 )
[0.635]
8
9
(.213)
[5.4]
SOLDER PASTE EXAMPLE
BASED ON .005 INCH [0.127 MM] THICK STENCIL
SCALE:8X
4214846/A 03/2014
NOTES: (continued)
8. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate
design recommendations.
9. Board assembly site may have different recommendations for stencil design.
www.ti.com