BUF07703_16 Datasheet, PDF (21/32 Pages) Texas Instruments – Multi-Channel LCD Gamma Correction Buffer

PACKAGE OPTION ADDENDUM
www.ti.com
5-May-2016
PACKAGING INFORMATION
Orderable Device
BUF05703PWG4
BUF05703PWR
BUF06703PWG4
BUF06703PWR
BUF07703PWP
BUF07703PWPRG4
Status Package Type Package Pins Package Eco Plan
(1)
Drawing
Qty
(2)
OBSOLETE TSSOP
PW 14
TBD
NRND
TSSOP
PW 14 2000 Green (RoHS
& no Sb/Br)
OBSOLETE TSSOP
PW 16
TBD
NRND
TSSOP
PW 16 2000 Green (RoHS
& no Sb/Br)
NRND HTSSOP
PWP 20
70 Green (RoHS
& no Sb/Br)
OBSOLETE HTSSOP
PWP 20
TBD
Lead/Ball Finish
(6)
Call TI
CU NIPDAU
Call TI
CU NIPDAU
CU NIPDAU
Call TI
MSL Peak Temp Op Temp (°C)
(3)
Call TI
-40 to 85
Level-1-260C-UNLIM -40 to 85
Call TI
Level-1-260C-UNLIM
-40 to 85
-40 to 85
Level-2-260C-1 YEAR -40 to 85
Call TI
-40 to 85
(1) _{The marketing status values are defined as follows:}
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
Device Marking
(4/5)
BUF05703
BF06703
BUF07703
BUF07703
(2) _{Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability}
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3) _{MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.}
(4) _{There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.}
(5) _{Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation}
of the previous line and the two combined represent the entire Device Marking for that device.
Samples
Addendum-Page 1