ADS7861_14 Datasheet, PDF (21/33 Pages) Texas Instruments – Dual, 500kSPS, 12-Bit, 2 + 2 Channel Simultaneous Sampling ANALOG-TO-DIGITAL CONVERTER

This package incorporates an exposed thermal pad that is designed to be attached directly to an external heatsink. The
thermal pad must be soldered directly to the printed circuit board (PCB). After soldering, the PCB can be used as a
heatsink. In addition, through the use of thermal vias, the thermal pad can be attached directly to the appropriate copper
plane shown in the electrical schematic for the device, or alternatively, can be attached to a special heatsink structure
designed into the PCB. This design optimizes the heat transfer from the integrated circuit (IC).