LMV601_16 Datasheet, PDF (20/35 Pages) Texas Instruments – LMV60x 1-MHz, Low-Power, General-Purpose, 2.7-V Operational Amplifiers

LMV601, LMV602, LMV604
SNOSC70C – APRIL 2012 – REVISED JULY 2016
10 Layout
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10.1 Layout Guideline
To properly bypass the power supply, consider the placement of several components on the printed-circuit boad.
A 6.8‑µF or greater tantalum capacitor must be placed at the point where the power supply for the amplifier is
introduced onto the board. Another 0.1-µF ceramic capacitor must be placed as close as possible to the power
supply pin of the amplifier. If the amplifier is operated in a single power supply, only the V⁺ pin must be bypassed
with a 0.1-µF capacitor. If the amplifier is operated in a dual power supply, both V⁺ and V^– pins must be
bypassed.
It is good practice to use a ground plane on a printed-circuit board to provide all components with a low inductive
ground connection.
TI recommends surface-mount components in 0805 size or smaller in the LMV601-N application circuits.
Designers can take advantage of the VSSOP miniature sizes to condense board layout to save space and
reduce stray capacitance.
10.2 Layout Example
Cbyp
GND
V+
INPUT
SHDN
OUTPUT
Rf
Cf
Figure 48. PCB Layout Example
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