TPS62751DSK Datasheet, PDF (2/30 Pages) Texas Instruments – High Efficiency Step-Down Converter for USB Applications

TPS62750, TPS62751
SLVS955A – JULY 2009 – REVISED SEPTEMBER 2009 ................................................................................................................................................. www.ti.com
This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with
appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more
susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.
T_A
PART NUMBER ⁽²⁾
-40°C to 85°C
TPS62750
TPS62751
Table 1. ORDERING INFORMATION⁽¹⁾
OUTPUT
VOLTAGE ⁽³⁾
Adjustable
PACKAGE
SON 2.5×2.5 -10
PACKAGE
DESIGNATOR
DSK
ORDERING
TPS62750DSK
TPS62751DSK
PACKAGE
MARKING
NXJ
DAL
(1) For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI
website at www.ti.com
(2) The DSK (SON-10) package is available in tape on reel. Add R suffix to order quantities of 3000 parts per reel.
(3) Contact TI for other fixed output voltage options
ABSOLUTE MAXIMUM RATINGS
Over operating free-air temperature range (unless otherwise noted)⁽¹⁾
Input voltage range V_IN, AV_IN ⁽²⁾
Voltage range at EN, H/L, FB
Voltage on L, I_{Lim_U}, I_{Lim_L}
Peak output current
ESD rating⁽³⁾
HBM Human body model
CDM Charge device model
Machine model
Maximum operating junction temperature, T_J
Storage temperature range, T_stg
VALUE
–0.3 to 7.0
–0.3 to VIN +0.3, ≤7.0
–0.3 to 7.0
Internally limited
4
1.5
200
–40 to 125
–65 to 150
UNIT
V
V
V
A
kV
V
°C
°C
(1) Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings
only and functional operation of the device at these or any other conditions beyond those indicated under recommended operating
conditions is not implied. Exposure to absolute–maximum–rated conditions for extended periods may affect device reliability.
(2) All voltage values are with respect to network ground terminal.
(3) The human body model is a 100pF capacitor discharged through a 1.5 kΩ resistor into each pin. The machine model is a 200pF
capacitor discharged directly into each pin.
PACK
AGE
DSK
THERMAL
RESISTANCE
R_θJA
60.6°C/W
DISSIPATION RATINGS^{(1) (2)}
THERMAL
RESISTANCE
R_θJP
THERMAL
RESISTANCE
R_θJC
POWER
RATING
FOR T_A ≤ 25°C
6.3°C/W
40°C/W
1650mW
DERATING
FACTOR
ABOVE T_A =
25°C
17mW/°C
(1) Maximum power dissipation is a function of T_J(max), θ_JA and T_A. The maximum allowable power
dissipation at any allowable ambient temperature is P_D = [T_J(max) - T_A]/θ_JA
(2) This thermal data is measured with a high-K board (4 layer board according to JESD51-7 JEDEC
standard).
RECOMMENDED OPERATING CONDITIONS
Supply Voltage V_IN
Output voltage range for adjustable voltage
Operating ambient temperature, T_A
Operating virtual junction temperature, T_J
MIN NOM MAX UNIT
2.9
6V
0.8
0.85 × V
VIN
–40
85 °C
–40
125 °C
2
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