TPS54678 Datasheet, PDF (2/37 Pages) Texas Instruments – 2.95 V to 6 V INPUT, 6 A OUTPUT, 2 MHz, SYNCHRONOUS STEP DOWN SWITCHER WITH INTEGRATED FET ( SWIFT™)

TPS54678
SLVSBF3 – JUNE 2012
www.ti.com
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
T_J
-40°C to 150°C
ORDERING INFORMATION
PACKAGE
3 x 3 mm QFN
PART NUMBER
TPS54678RTE
ABSOLUTE MAXIMUM RATINGS⁽¹⁾
over operating free-air temperature range (unless otherwise noted)
VIN
EN
BOOT
Input Voltage
VSENSE
COMP
PWRGD
SS/TR
RT/CLK
BOOT-PH
Output Voltage
PH
PH 20ns Transient
PH 5ns Transient
Source Current
EN
RT/CLK
COMP
Sink Current
PWRGD
SS/TR
Electrostatic Discharge
Human Body Model (HBM)
Charged device Model (CDM)
Operating Junction Temperature
Storage Temperature
VALUE
MIN
MAX
-0.3
7
-0.3
7
PH + 7
-0.3
3
-0.3
3
-0.3
6
-0.3
3
-0.3
6
7
-0.7
7
-2
10
-4
12
100
100
100
10
100
2
500
-40
150
-65
150
UNIT
V
V
V
V
V
V
V
V
V
V
V
V
µA
µA
µA
mA
µA
kV
V
ºC
ºC
(1) Stresses beyond those listed under “ABSOLUTE MAXIMUM RATINGS” may cause permanent damage to the device. These are stress
ratings only, and functional operation of the device at these or any other conditions beyond those indicated under “ELECTRICAL
SPECIFICATIONS” is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability
THERMAL INFORMATION
THERMAL METRIC⁽¹⁾
θ_JA
θ_JCtop
θ_JB
ψ_JT
ψ_JB
θ_JCbot
Junction-to-ambient thermal resistance
Junction-to-case (top) thermal resistance
Junction-to-board thermal resistance
Junction-to-top characterization parameter
Junction-to-board characterization parameter
Junction-to-case (bottom) thermal resistance
TPS54678
RTE (16 PINS)
43.2
38.5
14.5
0.4
14.5
3.4
UNITS
°C/W
(1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.
2
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