TLV710_16 Datasheet, PDF (2/32 Pages) Texas Instruments – Over-Current and Thermal Protection

TLV710 Series
TLV711 Series
SBVS142A – JULY 2010 – REVISED AUGUST 2010
www.ti.com
This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with
appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more
susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.
PRODUCT
TLV710xxyyqwwwz
TLV711xxyyqwwwz
ORDERING INFORMATION⁽¹⁾
V_OUT ⁽²⁾
XX is nominal output voltage of channel 1 (for example 18 = 1.8V).
YY is nominal output voltage of channel 2 (for example 28 = 2.8V).
Q is optional. Use "U" for devices with EN pin pull-up resistor, and "D" for devices with EN pin pull-down resistor.
WWW is package designator.
Z is package quantity. Use "R" for reel (3000 pieces), and "T" for tape (250 pieces).
(1) For the most current package and ordering information see the Package Option Addendum at the end of this document, or visit the
device product folder on www.ti.com.
(2) Output voltages from 1.2V to 4.8V in 50mV increments are available through the use of innovative factory OTP programming; minimum
order quantities may apply. Contact factory for details and availability.
ABSOLUTE MAXIMUM RATINGS⁽¹⁾
At T_J = –40°C to +125°C (unless otherwise noted).
Voltage ⁽²⁾
Current
Output short-circuit duration
Temperature
Electrostatic Discharge Rating
IN
EN
OUT
OUT
Operating junction, T_J
Storage, T_stg
Human body model (HBM) QSS 009-105 (JESD22-A114A)
Charged device model (CDM) QSS 009-147
(JESD22-C101B.01)
VALUE
MIN
MAX
–0.3
+6.0
–0.3 V_IN + 0.3
–0.3
+6.0
Internally limited
Indefinite
–55
+150
–55
+150
2
500
UNIT
V
V
V
A
s
°C
°C
kV
V
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated is not implied. Exposure to
absolute-maximum-rated conditions for extended periods my affect device reliability.
(2) All voltages with respect to ground.
THERMAL INFORMATION⁽¹⁾
THERMAL METRIC⁽²⁾
y_JT
Junction-to-top characterization parameter
TLV710, TLV711
DSE
6 PINS
6
UNITS
°C/W
(1) See the Power Dissipation section for more details.
(2) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.
2
Submit Documentation Feedback
Copyright © 2010, Texas Instruments Incorporated