TLV62150 Datasheet, PDF (2/31 Pages) Texas Instruments – 4-17V 1A Step-Down Converter with DCS-Control™

TLV62150
SLVSB71 – FEBRUARY 2012
www.ti.com
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
T_A
-40°C to 85°C
OUTPUT VOLTAGE
adjustable
ORDERING INFORMATION⁽¹⁾
PART NUMBER⁽²⁾
PACKAGE
ORDERING
TLV62150
16-Pin QFN
TLV62150RGT
PACKAGE MARKING
VUCI
(1) For detailed ordering information please check the PACKAGE OPTION ADDENDUM section at the end of this datasheet.
(2) Contact the factory to check availability of other fixed output voltage versions.
ABSOLUTE MAXIMUM RATINGS⁽¹⁾
over operating free-air temperature range (unless otherwise noted)
AVIN, PVIN
Pin voltage range⁽²⁾
EN, SS/TR
SW
DEF, FSW, FB, PG, VOS
Power Good sink current PG
Temperature range
ESD rating⁽³⁾
Operating junction temperature range, T_J
Storage temperature range, T_stg
HBM Human body model
CDM Charge device model
MIN
MAX
UNIT
-0.3
20
V
-0.3
V_IN+0.3
-0.3
V_IN+0.3
V
-0.3
7
V
10
mA
-40
125
°C
-65
150
2
kV
0.5
kV
(1) Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under recommended operating
conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) All voltages are with respect to network ground terminal.
(3) ESD testing is performed according to the respective JESD22 JEDEC standard.
THERMAL INFORMATION
THERMAL METRIC⁽¹⁾
TLV62150
RGT 16 PINS
UNITS
θ_JA
θ_JC(TOP)
θ_JB
ψ_JT
ψ_JB
θ_JC(BOTTOM)
Junction-to-ambient thermal resistance
Junction-to-case(top) thermal resistance
Junction-to-board thermal resistance
Junction-to-top characterization parameter
Junction-to-board characterization parameter
Junction-to-case(bottom) thermal resistance
29.1
15
11
°C/W
0.5
10
3.5
(1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.
RECOMMENDED OPERATING CONDITIONS
over operating free-air temperature range (unless otherwise noted)
Supply Voltage, V_IN (at AVIN and P VIN)
Operating free air temperature, T_A
Operating junction temperature, T_J
MIN TYP
4
–40
–40
MAX
17
85
125
UNIT
V
°C
°C
2
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