TLE214X_17 Datasheet, PDF (2/79 Pages) Texas Instruments – EXCALIBUR LOW-NOISE HIGH-SPEED PRECISION OPERATIONAL AMPLIFIERS

TLE214x, TLE214xA
EXCALIBUR LOW-NOISE HIGH-SPEED
PRECISION OPERATIONAL AMPLIFIERS
SLOS183D − FEBRUARY 1997 − REVISED OCTOBER 2012
TLE2141 AVAILABLE OPTIONS
PACKAGED DEVICES
T_A
V_IOmax
AT 25°C
SMALL OUT-
LINE^†
(D)
CERAMIC DIP
(JG)
PLASTIC DIP
(P)
0°C to 70°C
500 μV
900 μV
TLE2141ACD
TLE2141CD
—
TLE2141ACP
TLE2141CP
−40°C to 105°C
500 μV
900 μV
TLE2141AID
TLE2141ID
—
TLE2141AIP
TLE2141IP
−55°C to 125°C
500 μV
900 μV
—
TLE2141MD
TLE2141AMJG
TLE2141MJG
—
—
† _{The D packages are available taped and reeled. Add R suffix to device type (e.g.,}
TLE2141ACDR).
TLE2142 AVAILABLE OPTIONS
PACKAGED DEVICES
T_A
V_IOmax
AT 25°C
SMALL
OUTLINE^†
(D)
CHIP
CARRIER
(FK)
CERAMIC
DIP
(JG)
PLASTIC
DIP
(P)
TSSOP^‡
(PW)
750 μV TLE2142ACD
—
0°C to 70°C
1200 μV TLE2142CD
—
—
TLE2142ACP
—
—
TLE2142CP TLE2142CPWLE
750 μV TLE2142AID
—
−40°C to 105°C
1200 μV TLE2142ID
—
—
TLC2142AIP
—
—
TLC2142IP
—
750 μV TLE2142AMD TLE2142AMFK TLE2142AMJG
—
—
−55°C to 125°C _{1200 μV TLE2142MD TLE2142MFK TLE2142MJG}
—
—
† _{The D packages are available taped and reeled. Add R suffix to device type (e.g., TLC2142ACDR).}
‡ _{The PW packages are available left-ended taped and reeled. Add LE the suffix to device type (e.g., TLC2142CPWLE).}
CERAMIC
FLAT PACK
(U)
—
—
—
—
TLE2142AMU
TLE2142MU
TLE2144 AVAILABLE OPTIONS
PACKAGED DEVICES
T_A
V_IOmax
AT 25°C
SMALL OUTLINE^†
CHIP CARRIER
CERAMIC DIP
PLASTIC DIP
(DW)
(FK)
(J)
(N)
0°C to 70°C
1.5 mV
2.4 mV
—
TLE2144CDW
—
—
—
TLE2144ACN
—
TLE2144CN
−40°C to 105°C
1.5 mV
2.4 mV
—
TLE2144IDW
—
—
—
TLE2144AIN
—
TLE2144IN
−55°C to 125°C
1.5 mV
2.5 mV
—
TLE2144MDW
TLE2144AMFK
TLE2144MFK
TLE2144AMJ
TLE2144MJ
—
—
† _{The DW packages are available taped and reeled. Add R suffix to device type (e.g., TLE2144CDWR).}
symbol
OFFSET N1
(see Note A)
IN +
+
IN −
−
OUT
OFFSET N2
(see Note A)
NOTES: A. OFFSET N1 AND OFFSET N2
are only availiable on the
TLE2241x devices.
2
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