TLC5941_17 Datasheet, PDF (2/34 Pages) Texas Instruments – 16-CHANNEL LED DRIVER WITH DOT CORRECTION AND GRAYSCALE PWM CONTROL

TLC5941
SLVS589D – JULY 2005 – REVISED JANUARY 2008
www.ti.com
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
T_A
–40°C to 85°C
–40°C to 85°C
–40°C to 85°C
ORDERING INFORMATION
PACKAGE ⁽¹⁾
28-pin HTSSOP PowerPAD™
32-pin 5 mm x 5 mm QFN
28-pin PDIP
PART NUMBER
TLC5941PWP
TLC5941RHB
TLC5941NT
(1) For the most current package and ordering information, see the Package Option Addendum at the end
of this document, or see the TI Web site at www.ti.com.
ABSOLUTE MAXIMUM RATINGS.
over operating free-air temperature range (unless otherwise noted)⁽¹⁾
V_I
Input voltage range⁽²⁾
I_O
Output current (dc)
V_I
Input voltage range
V_O
Output voltage range
ESD rating
VCC
V_(BLANK), V_(SCLK), V_(XLAT), V_(MODE), V_(SIN), V_(GSCLK), V_(IREF), V_(TEST)
V_(SOUT), V_(XERR)
V_(OUT0) to V_(OUT15)
HBM (JEDEC JESD22-A114, Human Body Model)
CDM (JEDEC JESD22-C101, Charged Device Model)
T_J(max)
T_stg
T_A
Operating junction temperature
Storage temperature range
Operating ambient temperature range
HTSSOP (PWP)⁽⁴⁾
Package thermal impedance⁽³⁾ QFN (RHB)⁽⁴⁾
PDIP (NT)
UNIT
–0.3 V to 6 V
90 mA
–0.3 V to V_CC +0.3 V
–0.3 V to V_CC +0.3 V
–0.3 V to 18 V
2 kV
500 V
150°C
–55°C to 150°C
–40°C to 85°C
31.58°C/W
35.9°C/W
48°C/W
(1) Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under recommended operating
conditions is not implied. Exposure to absolute maximum rated conditions for extended periods may affect device reliability.
(2) All voltage values are with respect to network ground terminal.
(3) The package thermal impedance is calculated in accordance with JESD 51-7.
(4) With PowerPAD soldered on PCB with 2-oz. trace of copper. See TI application report SLMA002 for further information.
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