TL3116_16 Datasheet, PDF (2/19 Pages) Texas Instruments – ULTRA-FAST LOW-POWER PRECISION COMPARATORS

TL3116, TL3116Y
ą
ULTRAĆFAST LOWĆPOWER
PRECISION COMPARATORS
SLCS132C − MARCH 1997 − REVISED MAY 1997
TL3116Y chip information
This chip, when properly assembled, displays characteristics similar to the TL3116C. Thermal compression or
ultrasonic bonding may be used on the doped-aluminum bonding pads. Chips may be mounted with conductive
epoxy or a gold-silicon preform.
BONDING PAD ASSIGNMENTS
(1)
(1)
(1)
(8)
(7)
(5)
LATCH ENABLE
VCC+
(1)
(2)
IN+
+
(3)
IN−
−
(8)
Q OUT
(7) ^{Q OUT}
(2)
55
(3)
(4)
(4)
VCC _− ⁽⁶⁾
GND
(6)
CHIP THICKNESS: 10 MILS TYPICAL
BONDING PADS: 4 × 4 MILS MINIMUM
(6)
TJ max = 150°C
(5)
(6)
TOLERANCES ARE ± 10%.
ALL DIMENSIONS ARE IN MILS.
TERMINALS 1 AND 6 CAN BE
63
CONNECTED TO MULTIPLE PADS.
COMPONENT COUNT
Bipolars
53
MOSFETs
49
Resistors
46
Capacitors
14
2
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