THS7314EVM Datasheet, PDF (2/31 Pages) Texas Instruments – 3-Channel SDTV Video Amplifier With 5th-Order Filters and 6-dB Gain

THS7314
SLOS513A – DECEMBER 2006 – REVISED MARCH 2011
www.ti.com
This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with
appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more
susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.
PACKAGED DEVICES
THS7314D
THS7314DR
PACKAGING/ORDERING INFORMATION
PACKAGE TYPE⁽¹⁾
SOIC-8
TRANSPORT MEDIA, QUANTITY
Rails, 75
Tape and Reel, 2500
(1) For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI
website at www.ti.com.
ABSOLUTE MAXIMUM RATINGS
over operating free-air temperature range (unless otherwise noted) ⁽¹⁾
Supply voltage, V_S+ to GND
V_I
Input voltage
I_O
Output current
Continuous power dissipation
T_J
Maximum junction temperature, any condition⁽²⁾
T_J
Maximum junction temperature, continuous operation, long term reliability⁽³⁾
T_stg Storage temperature range
HBM
ESD ratings
CDM
MM
VALUE
UNIT
5.5
V
–0.4 V to V_S+
90
mA
See Dissipation Rating Table
150
°C
125
°C
–65 to 150
°C
2000
1500
V
200
(1) Stresses above those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings
only and functional operation of the device at these or any other conditions beyond those indicated under recommended operating
conditions is not implied. Exposure to absolute maximum rated conditions for extended periods may degrade device reliability.
(2) The absolute maximum junction temperature under any condition is limited by the constraints of the silicon process.
(3) The absolute maximum junction temperature for continuous operation is limited by the package constraints. Operation above this
temperature may result in reduced reliability and/or lifetime of the device.
DISSIPATION RATINGS
PACKAGE
SOIC-8 (D)
θ_JC
(°C/W)
50
θ_JA
(°C/W)
130 ⁽²⁾
POWER RATING⁽¹⁾
(T_J = 125°C)
T_A = 25°C
T_A = 85°C
769 mW
308 mW
(1) Power rating is determined with a junction temperature of 125°C. This is the point where performance starts to degrade and long-term
reliability starts to be reduced. Thermal management of the final PCB should strive to keep the junction temperature at or below 125°C
for best performance and reliability.
(2) This data was taken with the JEDEC High-K test PCB. For the JEDEC low-K test PCB, the θ_JA is 196°C/W.
RECOMMENDED OPERATING CONDITIONS
V_S+
Supply voltage
T_A
Ambient temperature
MIN
MAX UNIT
3
5
V
–40
85
°C
2
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