THS7103 Datasheet, PDF (2/9 Pages) Texas Instruments – ADSL (ISDN) CENTRAL OFFICE LINE INTERFACE DRIVER/RECEIVER

THS7103
SLOS387 − DECEMBER 2001
THS7103 Features
Device
Application
Transmit
Bandpass Filter^†
Receiver
Lowpass Filter
THS7103
ADSL (ISDN)
268 kHz to 1.3 MHz
238 kHz
† _{When used in conjunction with the appropriate input capacitor (see the functional block}
diagram information)
AVAILABLE OPTIONS
PACKAGED DEVICES
TA
PowerPAD (VFP)
0°C to 70°C
THS7103CVFP
−40°C to 85°C
THS7103IVFP
absolute maximum ratings over operating free-air temperature (unless otherwise noted)^‡
Supply voltage, VCCL, VCCOP1, VCCOP2 (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17 V
Input voltage, V_I . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . GND, VCCL, VCCOPx
Output current, I_O (see Note 2): Tx outputs . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 400 mA
Rx outputs . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 50 mA
BUF outputs . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 50 mA
Differential input voltage, V_ID . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ± 3 V
ESD rating: HBM . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 kV
CDM . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 500 V
MM . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 200 V
Total power dissipation at (or below) 25°C free-air temperature
(see Note 2) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . See Dissipation Rating Table
Maximum junction temperature, T_J . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 150°C
Operating free-air temperature, T_A: C-suffix . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 0°C to 70°C
I-suffix . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −40°C to 85°C
Storage temperature, T_stg . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −65°C to 125°C
Lead temperature 1,6 mm (1/16 in) from case for 10 seconds . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 300°C
‡ _{Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and}
functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not
implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
NOTES: 1. VCCL must always be equal to VCCOP1 and VCCOP2
2. The THS7103 incorporates a PowerPAD on the underside of the chip. This acts as a heatsink and must be connected to a thermally
dissipative plane for proper power dissipation. Failure to do so may result in exceeding the maximum junction temperature which
could permanently damage the device.
PACKAGE
θ_JA
(°C/W)
DISSIPATION RATING TABLE§
θ_JC
(°C/W)
TA = 25°C^¶
POWER RATING
TA = 70°C^¶
POWER RATING
TA = 85°C^¶
POWER RATING
VFP
29.4
0.96
3.57 W
2.04 W
1.53 W
§ _{This data was taken using 2 oz. trace and copper pad that is soldered directly to a JEDEC standard 4 layer 3 in × 3 in PCB.}
¶ _{The power rating is determined with a junction temperature of 130°C. This is the junction temperature at which distortion}
begins to substantially increase. Thermal management of the PCB should strive to keep the junction temperature at or below
125°C for the best performance.
2
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