THS6002_16 Datasheet, PDF (2/46 Pages) Texas Instruments – DUAL DIFFERENTIAL LINE DRIVERS AND RECEIVERS

THS6002
ą
DUAL DIFFERENTIAL LINE DRIVERS AND RECEIVERS
ą
SLOS202E− JANUARY 1998− REVISED MARCH 2007
description (continued)
The THS6002 is packaged in the patented PowerPAD package. This package provides outstanding thermal
characteristics in a small footprint package, which is fully compatible with automated surface mount assembly
procedures. The exposed thermal pad on the underside of the package is in direct contact with the die. By simply
soldering the pad to the PWB copper and using other thermal outlets, the heat is conducted away from the
junction.
AVAILABLE OPTIONS
PACKAGED DEVICE
TA
PowerPAD PLASTIC
SMALL OUTLINE†
(DWP)
EVALUATION
MODULE
0°C to 70°C
THS6002CDWP
THS6002EVM
−40°C to 85°C
THS6002IDWP
† _{The DWP packages are available taped and reeled. Add an R suffix to the}
device type (i.e., THS6002CDWPR)
absolute maximum ratings over operating free-air temperature (unless otherwise noted)^†
Supply voltage, V_CC+ to V_CC− . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 33 V
Input voltage, V_I (driver and receiver) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ± V_CC
Output current, I_O (driver) (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 800 mA
Output current, I_O (receiver) (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 150 mA
Differential input voltage, V_ID (driver and receiver) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 V
Continuous total power dissipation at (or below) T_A = 25°C (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . 5.8 W
Operating free air temperature, T_A . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −40°C to 85°C
Storage temperature, T_stg . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −65°C to 125°C
Lead temperature, 1,6 mm (1/16 inch) from case for 10 seconds . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 300°C
† _{Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and}
functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not
implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
NOTE 1: The THS6002 incorporates a PowerPad on the underside of the chip. This acts as a heatsink and must be connected to a thermal
dissipation plane for proper power dissipation. Failure to do so can result in exceeding the maximum junction temperature, which could
permanently damage the device. See the Thermal Information section of this document for more information about PowerPad
technology.
recommended operating conditions
Supply voltage, VCC+ and VCC _−
Operating free-air temperature, TA
Split supply
Single supply
C suffix
I suffix
MIN
± 4.5
9
0
− 40
TYP MAX UNIT
± 16
V
32
70
°C
85
2
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