THS3120_14 Datasheet, PDF (2/36 Pages) Texas Instruments – LOW-NOISE, HIGH-OUTPUT DRIVE, CURRENT-FEEDBACK OPERATIONAL AMPLIFIERS

THS3120
THS3121
SLOS420E – SEPTEMBER 2003 – REVISED OCTOBER 2009........................................................................................................................................ www.ti.com
This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with
appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more
susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.
TOP VIEW
D, DGN
REF
V_IN-
V_IN+
V_S-
THS3120
1
8
2
7
3
6
4
5
PD
V_S+
V_OUT
NC
NC = No Internal Connection
TOP VIEW
D, DGN
NC
V_IN-
V_IN+
V_S-
THS3121
1
8
2
7
3
6
4
5
NC
V_S+
V_OUT
NC
NC = No Internal Connection
NOTE: The device with the power down option defaults to the ON state if no signal is applied to the PD pin. Additionally, the
REF pin functional range is from V_S– to (V_S+ – 4 V).
T_A
0°C to +70°C
–40°C to +85°C
0°C to +70°C
–40°C to +85°C
AVAILABLE OPTIONS⁽¹⁾
PACKAGED DEVICE
PLASTIC SMALL OUTLINE SOIC (D)
PLASTIC MSOP (DGN) ^{(2) (3)}
THS3120CD
THS3120CDGN
THS3120CDR
THS3120CDGNR
THS3120ID
THS3120IDGN
THS3120IDR
THS3120IDGNR
THS3121CD
THS3121CDGN
THS3121CDR
THS3121CDGNR
THS3121ID
THS3121IDGN
THS3121IDR
THS3121IDGNR
SYMBOL
AQA
APN
AQO
APO
(1) For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI
web site at www.ti.com.
(2) Available in tape and reel. The R suffix standard quantity is 2500 (for example, THS3120CDGNR).
(3) The PowerPAD is electrically isolated from all other pins.
DISSIPATION RATING TABLE
PACKAGE
D-8 ⁽¹⁾
DGN-8 ⁽²⁾
θ_JC (°C/W)
38.3
4.7
θ_JA (°C/W)
95
58.4
POWER RATING
T_J = +125°C
T_A = +25°C
T_A = +85°C
1.05 W
421 mW
1.71 W
685 W
(1) These data were taken using the JEDEC standard low-K test PCB. For the JEDEC proposed high-K test PCB, the θ_JA is +95°C/W with
power rating at T_A = +25°C of 1.05 W.
(2) These data were taken using 2 oz. (56,7 grams) trace and copper pad that is soldered directly to a 3 inch x 3 inch (76,2 mm x 76,2 mm)
PCB. For further information, see the Application Information section of this data sheet.
2
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