THS3061_16 Datasheet, PDF (2/33 Pages) Texas Instruments – LOW-DISTORTION, HIGH SLEW RATE, CURRENT-FEEDBACK AMPLIFIERS

THS3061
THS3062
SLOS394B – JULY 2002 – REVISED NOVEMBER 2009
www.ti.com
This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with
appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more
susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.
ABSOLUTE MAXIMUM RATINGS
Over operating free-air temperature range unless otherwise noted.⁽¹⁾
V_S
Supply voltage
V_I
Input voltage
I_O
Output current
V_ID
Differential input voltage
Continuous power dissipation
±16.5 V
±V_S
200 mA
±3 V
See Dissipation Ratings Table
T_J
T_J ⁽²⁾
T_stg
Maximum junction temperature
Maximum junction temperature, continuous operation, long term reliability
Storage temperature range
+150°C
+125°C
–65°C to +150°C
(1) The absolute maximum ratings under any condition is limited by the constraints of the silicon process. Stresses above these ratings may
cause permanent damage. Exposure to absolute maximum conditions for extended periods may degrade device reliability. These are
stress ratings only, and functional operation of the device at these or any other conditions beyond those specified is not implied.
(2) The maximum junction temperature for continuous operation is limited by package constraints. Operation above this temperature may
result in reduced reliability and/or lifetime of the device.
PACKAGE DISSIPATION RATINGS
PACKAGE
θ_JC
(°C/W)
D (8 pin)
DDA (8 pin)⁽³⁾
DGN (8 pin) ⁽³⁾
38.3
9.2
4.7
θ_JA
(°C/W) ⁽¹⁾
97.5
45.8
58.4
POWER RATING
(T_J = +125°C)⁽²⁾
T_A ≤ +25°C
T_A = +85°C
1.02 W
410 mW
2.18 W
873 mW
1.71 W
680 mW
(1) This data was taken using the JEDEC High-K test PCB.
(2) This data was taken using 2 oz. trace and copper pad that is soldered directly to a 3 in x 3 in PCB.
(3) The THS306x may incorporate a PowerPAD on the underside of the chip. This acts as a heatsink and must be connected to a thermally
dissipative plane for proper power dissipation. Failure to do so may result in exceeding the maximum junction temperature which could
permanently damage the device. See TI technical brief SLMA002 for more information about utilizing the PowerPAD thermally enhanced
package.
RECOMMENDED OPERATING CONDITIONS
Supply voltage
Dual supply
Single supply
MIN MAX UNIT
±5
±15
V
10
30
2
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