SN74LVC1G17DBVE4 Datasheet, PDF (2/26 Pages) Texas Instruments – SINGLE SCHMITT-TRIGGER BUFFER

SN74LVC1G17
SCES351S – JULY 2001 – REVISED JUNE 2011
www.ti.com
DESCRIPTION/ORDERING INFORMATION
This single Schmitt-trigger buffer is designed for 1.65-V to 5.5-V V_CC operation.
The SN74LVC1G17 contains one buffer and performs the Boolean function Y = A. The device functions as an
independent buffer, but because of Schmitt action, it may have different input threshold levels for positive-going
(V_T+) and negative-going (V_T–) signals.
NanoFree™ package technology is a major breakthrough in IC packaging concepts, using the die as the
package.
This device is fully specified for partial-power-down applications using I_off. The I_off circuitry disables the outputs,
preventing damaging current backflow through the device when it is powered down.
T_A
–40°C to 85°C
ORDERING INFORMATION
PACKAGE^{(1) (2)}
ORDERABLE PART NUMBER TOP-SIDE MARKING⁽³⁾
NanoFree™ – WCSP (DSBGA)
0.23-mm Large Bump – YZP (Pb-free)
Reel of 3000 SN74LVC1G17YZPR
_ _ _C7_
NanoFree™ – WCSP (DSBGA)
0.23-mm Large Bump – YZV (Pb-free)
Reel of 3000 SN74LVC1G17YZVR
____
C7
QFN – DRY
SN74LVC1G17DRYR
Reel of 5000
C7
SN74LVC1G17DRYRG4
µQFN – DSF
Reel of 5000 SN74LVC1G17DSFR
C7
SN74LVC1G17DBV3
SOT (SOT-23) – DBV
SN74LVC1G17DBVR
Reel of 3000
SN74LVC1G17DBVRE4
C17
SN74LVC1G17DBVRG4
Tube of 250
SN74LVC1G17DBVT
SN74LVC1G17DBVTE4
SN74LVC1G17DCK3
SOT (SC-70) – DCK
SN74LVC1G17DCKR
Reel of 3000
SN74LVC1G17DCKRE4
C7_
SN74LVC1G17DCKRG4
Tube of 250
SN74LVC1G17DCKT
SN74LVC1G17DCKTE4
SOT (SOT-553) – DRL
SN74LVC1G17DRLR
Reel of 4000
C7_
SN74LVC1G17DRLRG4
(1) Package drawings, thermal data, and symbolization are available at www.ti.com/packaging.
(2) For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI
website at www.ti.com.
(3) DBV/DCK/DRL/DRY: The actual top-side marking has one additional character that designates the wafer fab/assembly site.
YZP: The actual top-side marking has three preceding characters to denote year, month, and sequence code, and one following
character to designate the wafer fab/assembly site. Pin 1 identifier indicates solder-bump composition (1 = SnPb, • = Pb-free).
YZV: The actual top-side marking is two lines. Line 1 has four characters to denote year, month, day, and wafer fab/assembly site. Line
2 has two characters which show the family and function code. Pin 1 identifier indicates solder-bump composition (1 = SnPb, • =
Pb-free).
2
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