SN74AUP2G34 Datasheet, PDF (2/19 Pages) Texas Instruments – LOW-POWER DUAL BUFFER GATE

SN74AUP2G34
SCES751B – SEPTEMBER 2009 – REVISED MARCH 2010
www.ti.com
This device is fully specified for partial-power-down applications using I_off. The I_off circuitry disables the outputs,
preventing damaging current backflow through the device when it is powered down.
T_A
–40°C to 85°C
ORDERING INFORMATION⁽¹⁾
PACKAGE ⁽²⁾
ORDERABLE PART NUMBER TOP-SIDE MARKING⁽³⁾
NanoStar™ – WCSP (DSBGA)
0.23-mm Large Bump – YFP (Pb-free)
Reel of 3000
SN74AUP2G34YFPR
___H9_
QFN – DRY
Reel of 5000
SN74AUP2G34DRYR
PZ
uQFN – DSF
Reel of 5000
SN74AUP2G34DSFR
PZ
SOT (SC-70) – DCK
Reel of 3000
SN74AUP2G34DCKR
PZ_
(1) For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI
web site at www.ti.com.
(2) Package drawings, thermal data, and symbolization are available at www.ti.com/packaging.
(3) DCK: The actual top-side marking has one additional character that designates the wafer fab/assembly site.
YFP: The actual top-side marking has three preceding characters to denote year, month, and sequence code, and one following
character to designate the wafer fab/assembly site. Pin 1 identifier indicates solder-bump composition (1 = SnPb, • = Pb-free).
FUNCTION TABLE
INPUT
A
OUTPUT
Y
H
H
L
L
LOGIC DIAGRAM (POSITIVE LOGIC)
1
1A
6
1Y
3
2A
4
2Y
ABSOLUTE MAXIMUM RATINGS⁽¹⁾
over operating free-air temperature range (unless otherwise noted)
V_CC
Supply voltage range
V_I
Input voltage range⁽²⁾
V_O
Voltage range applied to any output in the high-impedance or power-off state⁽²⁾
V_O
Output voltage range in the high or low state⁽²⁾
I_IK
Input clamp current
V_I < 0
I_OK
Output clamp current
V_O < 0
I_O
Continuous output current
Continuous current through V_CC or GND
DCK package
q_JA
Package thermal impedance⁽³⁾
DRL package
DRY package
DSF package
YFP package
T_stg
Storage temperature range
MIN
MAX
–0.5
4.6
–0.5
4.6
–0.5
4.6
–0.5 V_CC + 0.5
–50
–50
±20
±50
252
142
234
300
132
–65
150
UNIT
V
V
V
V
mA
mA
mA
mA
°C/W
°C
(1) Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under "recommended operating
conditions" is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) The input negative-voltage and output voltage ratings may be exceeded if the input and output current ratings are observed.
(3) The package thermal impedance is calculated in accordance with JESD 51-7.
2
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