SN74AUP2G17_15 Datasheet, PDF (2/21 Pages) Texas Instruments – LOW-POWER DUAL SCHMITT-TRIGGER BUFFER

SN74AUP2G17
SCES750A – SEPTEMBER 2009 – REVISED MAY 2010
www.ti.com
The SN74AUP2G17 contains two buffers and performs the Boolean function Y = A. The device functions as two
independent buffers, but because of Schmitt action, it may have different input threshold levels for positive-going
(V_T+) and negative-going (V_T–) signals.
NanoStar™ package technology is a major breakthrough in IC packaging concepts, using the die as the
package.
This device is fully specified for partial-power-down applications using I_off. The I_off circuitry disables the outputs,
preventing damaging current backflow through the device when it is powered down.
T_A
–40°C to 85°C
ORDERING INFORMATION^{(1) (2)}
PACKAGE
ORDERABLE PART NUMBER TOP-SIDE MARKING⁽³⁾
NanoStar™ – WCSP (DSBGA)
0.23-mm Large Bump – YFP (Pb-free)
Reel of 3000
SN74AUP2G17YFPR
___H7_
QFN – DSF
Reel of 5000
SN74AUP2G17DSFR
HL
uQFN – DRY
Reel of 5000
SN74AUP2G17DRYR
HL
SOT (SC-70) – DCK
Reel of 3000
SN74AUP2G17DCKR
HL_
(1) Package drawings, thermal data, and symbolization are available at www.ti.com/packaging.
(2) For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI
website at www.ti.com.
(3) DCK: The actual top-side marking has one additional character that designates the wafer fab/assembly site.
YFP: The actual top-side marking has three preceding characters to denote year, month, and sequence code, and one following
character to designate the wafer fab/assembly site. Pin 1 identifier indicates solder-bump composition (1 = SnPb, • = Pb-free).
FUNCTION TABLE
(Each Inverter)
INPUT
A
OUTPUT
Y
H
H
L
L
LOGIC DIAGRAM (POSITIVE LOGIC)
1
1A
6
1Y
3
2A
4
2Y
2
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