SN74AUP2G07 Datasheet, PDF (2/21 Pages) Texas Instruments – LOW-POWER DUAL BUFFER/DRIVER WITH OPEN-DRAIN OUTPUTS

SN74AUP2G07
SCES748B – SEPTEMBER 2009 – REVISED MAY 2010
www.ti.com
The output of the SN74AUP2G07 is open drain and can be connected to other open-drain outputs to implement
active-low wired-OR or active-high wired-AND functions.
NanoStar™ package technology is a major breakthrough in IC packaging concepts, using the die as the
package.
This device is fully specified for partial-power-down applications using I_off. The I_off circuitry disables the outputs,
preventing damaging current backflow through the device when it is powered down.
T_A
–40°C to 85°C
ORDERING INFORMATION⁽¹⁾
PACKAGE ⁽²⁾
ORDERABLE PART NUMBER TOP-SIDE MARKING⁽³⁾
NanoStar™ – WCSP (DSBGA)
0.23-mm Large Bump – YFP (Pb-free)
Reel of 3000
SN74AUP2G07YFPR
___HV_
QFN – DRY
Reel of 5000
SN74AUP2G07DRYR
H5
uQFN – DSF
Reel of 5000
SN74AUP2G07DSFR
H5
SOT (SC-70) – DCK
Reel of 3000
SN74AUP2G07DCKR
H5_
(1) For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI
web site at www.ti.com.
(2) Package drawings, thermal data, and symbolization are available at www.ti.com/packaging.
(3) DCK/DRY: The actual top-side marking has one additional character that designates the wafer fab/assembly site.
YFP: The actual top-side marking has three preceding characters to denote year, month, and sequence code, and one following
character to designate the wafer fab/assembly site. Pin 1 identifier indicates solder-bump composition (1 = SnPb, ● = Pb-free).
FUNCTION TABLE
INPUT
A
OUTPUT
Y
L
L
H
Z
LOGIC DIAGRAM (POSITIVE LOGIC)
1A ¹
6 _1Y
2A ³
4 _2Y
2
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