SN74AUC1G32_15 Datasheet, PDF (2/17 Pages) Texas Instruments – SINGLE 2-INPUT POSITIVE-OR GATE

SN74AUC1G32
SCES377O – SEPTEMBER 2001 – REVISED SEPTEMBER 2009 ................................................................................................................................... www.ti.com
ORDERING INFORMATION
T_A
PACKAGE ^{(1) (2)}
ORDERABLE PART NUMBER TOP-SIDE MARKING⁽³⁾
NanoFree™ – WCSP (DSBGA)
0.23-mm Large Bump – YZP (Pb-free)
Reel of 3000
SN74AUC1G32YZPR
_ _ _UG_
SON – DRY
–40°C to 85°C _{SOT (SOT-23) – DBV}
Reel of 5000
Reel of 3000
SN74AUC1G32DRYR
SN74AUC1G32DBVR
PREVIEW
U32_
SOT (SC-70) – DCK
Reel of 3000 SN74AUC1G32DCKR
UG_
SOT (SOT-553) – DRL
Reel of 4000 SN74AUC1G32DRLR
UG_
(1) For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI
web site at www.ti.com.
(2) Package drawings, thermal data, and symbolization are available at www.ti.com/packaging.
(3) DBV/DCK/DRL/DRY: The actual top-side marking has one additional character that designates the wafer fab/assembly site.
YZP: The actual top-side marking has three preceding characters to denote year, month, and sequence code, and one following
character to designate the wafer fab/assembly site. Pin 1 identifier indicates solder-bump composition (1 = SnPb, • = Pb-free).
FUNCTION TABLE
INPUTS
A
B
H
X
X
H
L
L
OUTPUT
Y
H
H
L
LOGIC DIAGRAM (POSITIVE LOGIC)
Absolute Maximum Ratings⁽¹⁾
over operating free-air temperature range (unless otherwise noted)
V_CC
Supply voltage range
V_I
Input voltage range⁽²⁾
V_O
Voltage range applied to any output in the high impedance or power-off state⁽²⁾
V_O
Output voltage range⁽²⁾
I_IK
Input clamp current
V_I < 0
I_OK
Output clamp current
V_O < 0
I_O
Continuous output current
Continuous current through V_CC or GND
DBV package
θ_JA
Package thermal impedance⁽³⁾
DCK package
DRL package
DRY package
YZP package
T_stg
Storage temperature range
MIN
MAX
–0.5
3.6
–0.5
3.6
–0.5
3.6
–0.5 V_CC + 0.5
–50
–50
±20
±100
206
252
142
234
132
–65
150
UNIT
V
V
V
V
mA
mA
mA
mA
°C/W
°C
(1) Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under "recommended operating
conditions" is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) The input negative-voltage and output voltage ratings may be exceeded if the input and output current ratings are observed.
(3) The package thermal impedance is calculated in accordance with JESD 51-7.
2
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