SM73403 Datasheet, PDF (2/8 Pages) Texas Instruments – Single General Purpose Voltage Comparator

SM73403
SNOSBA0A – OCTOBER 2011 – REVISED APRIL 2013
Typical Circuit
V_S
R₁
V_IN
-
R_PULL-UP
V_O
+
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R₃
R₂
Figure 2. Inverting Comparator with Hysteresis
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
Absolute Maximum Ratings ⁽¹⁾⁽²⁾
ESD Tolerance ⁽³⁾
Human Body Model
Machine Model
V_IN Differential
Supply Voltages
Voltage at Input Pins
Storage Temperature Range
Junction Temperature ⁽⁴⁾
Soldering Information
Infrared or Convection (20 sec.)
Wave Soldering (10 sec.)
2KV
200V
30V
30V or ±15V
−0.3V to 30V
−65°C to +150°C
+150°C
235°C
260°C
(1) Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for
which the device is intended to be functiona. For specifications and the test conditions, see the Electrical Characteristics.
(2) If Military/Aerospace specified devices are required, please contact the Texas Instruments Sales Office/ Distributors for availability and
specifications.
(3) Human Body Model, applicable std. MIL-STD-883, Method 3015.7. Machine Model, applicable std. JESD22-A115-A (ESD MM std. of
JEDEC) Field-Induced Charge-Device Model, applicable std. JESD22-C101-C (ESD FICDM std. of JEDEC).
(4) The maximum power dissipation is a function of T_J(MAX), θ_JA. The maximum allowable power dissipation at any ambient temperature is
P_D = (T_J(MAX) - T_A)/ θ_JA . All numbers apply for packages soldered directly onto a PC board.
Operating Ratings ⁽¹⁾
Supply Voltage, V_S
Temperature Range ⁽²⁾
Package Thermal Resistance ⁽²⁾
5-Pin SOT23
5V to 30V
−40°C to +85°C
168°C/W
(1) Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for
which the device is intended to be functiona. For specifications and the test conditions, see the Electrical Characteristics.
(2) The maximum power dissipation is a function of T_J(MAX), θ_JA. The maximum allowable power dissipation at any ambient temperature is
P_D = (T_J(MAX) - T_A)/ θ_JA . All numbers apply for packages soldered directly onto a PC board.
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