OPA171-Q1 Datasheet, PDF (2/18 Pages) Texas Instruments – 36V, SINGLE-SUPPLY, GENERAL-PURPOSE OPERATIONAL AMPLIFIER

OPA171-Q1
SBOS556 – JUNE 2011
www.ti.com
This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with
appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more
susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.
DBV PACKAGE: OPA171-Q1
SOT23-5
(TOP VIEW)
OUT 1
V- 2
+IN 3
5 V+
4 -IN
T_A
–40°C to 125°C
ORDERING INFORMATION⁽¹⁾
PACKAGE
ORDERABLE PART
NUMBER
SOT (SOT-23) – DBV Reel of 3000
OPA171AQDBVRQ1
TOP-SIDE MARKING
OULQ
(1) For the most current package and ordering information, see the Package Option Addendum at the end of this document, or visit the
device product folder at www.ti.com.
ABSOLUTE MAXIMUM RATINGS⁽¹⁾
Over operating free-air temperature range, unless otherwise noted.
Supply voltage
Signal input terminals
Output short circuit⁽²⁾
Voltage
Current
Operating temperature
Storage temperature
Junction temperature
ESD ratings:
Human body model (HBM)
Charged device model (CDM)
OPA171-Q1
±20
(V–) – 0.5 to (V+) + 0.5
±10
Continuous
–55 to +150
–65 to +150
+150
4
500
UNIT
V
V
mA
°C
°C
°C
kV
V
(1) Stresses above these ratings may cause permanent damage. Exposure to absolute maximum conditions for extended periods may
degrade device reliability. These are stress ratings only, and functional operation of the device at these or any other conditions beyond
those specified is not implied.
(2) Short-circuit to ground, one amplifier per package.
THERMAL INFORMATION
THERMAL METRIC⁽¹⁾
θ_JA
θ_JC(top)
θ_JB
ψ_JT
ψ_JB
θ_JC(bottom)
Junction-to-ambient thermal resistance
Junction-to-case(top) thermal resistance
Junction-to-board thermal resistance
Junction-to-top characterization parameter
Junction-to-board characterization parameter
Junction-to-case(bottom) thermal resistance
OPA171-Q1
DBV (SOT-23)
5 PINS
277.3
193.3
121.2
51.8
109.5
n/a
UNITS
°C/W
(1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.
2
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