LMH6555_14 Datasheet, PDF (2/37 Pages) Texas Instruments – LMH6555 Low Distortion 1.2 GHz Differential Driver

LMH6555
SNOSAJ1C – NOVEMBER 2006 – REVISED MARCH 2011
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These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
ABSOLUTE MAXIMUM RATINGS ⁽¹⁾⁽²⁾
ESD Tolerance ⁽³⁾
Human Body Model
Machine Model
V_S
Output Short Circuit Duration(one pin to ground)
Common Mode Input Voltage
Maximum Junction Temperature
Storage Temperature Range
Soldering Information
Infrared or Convection (20 sec.)
Wave Soldering (10 sec.)
2000V
200V
4.2V
Infinite
−0.4V to 3V
+150°C
−65°C to +150°C
235°C
260°C
(1) Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for
which the device is intended to be functional, but specific performance is not ensured. For specifications, see the Electrical
Characteristics tables.
(2) If Military/Aerospace specified devices are required, please contact the Texas Instruments Sales Office/ Distributors for availability and
specifications.
(3) Human Body Model, applicable std. MIL-STD-883, Method 3015.7. Machine Model, applicable std. JESD22-A115-A (ESD MM std. of
JEDEC)Field-Induced Charge-Device Model, applicable std. JESD22-C101-C (ESD FICDM std. of JEDEC).
OPERATING RATINGS ⁽¹⁾
Temperature Range ⁽²⁾
−40°C to +85°C
Supply Voltage Range
Package Thermal Resistance (θ_JA)⁽²⁾
16-Pin WQFN
+3.3V ±10%
65°C/W
(1) Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for
which the device is intended to be functional, but specific performance is not ensured. For specifications, see the Electrical
Characteristics tables.
(2) The maximum power dissipation is a function of T_J(MAX), θ_JA and T_A. The maximum allowable power dissipation at any ambient
temperature is P_D= (T_J(MAX) — T_A)/ θ_JA. All numbers apply for package soldered directly into a 2 layer PC board with zero air flow.
Package should be soldered unto a 6.8 mm² copper area as shown in the “recommended land pattern” shown in the package drawing.
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