LMC6462 Datasheet, PDF (2/31 Pages) National Semiconductor (TI) – Micropower, Rail-to-Rail Input and Output CMOS Operational Amplifier

LMC6462, LMC6464
SNOS725D – MAY 1999 – REVISED MARCH 2013
www.ti.com
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
Absolute Maximum Ratings^(1)(2)(3)
ESD Tolerance⁽⁴⁾
Differential Input Voltage
Voltage at Input/Output Pin
Supply Voltage (V⁺ − V^−)
Current at Input Pin⁽⁵⁾
Current at Output Pin⁽⁶⁾⁽⁷⁾
Current at Power Supply Pin
Lead Temp. (Soldering, 10 sec.)
Storage Temperature Range
Junction Temperature⁽⁸⁾
2.0 kV
±Supply Voltage
(V⁺) + 0.3V, (V^−) − 0.3V
16V
±5 mA
±30 mA
40 mA
260°C
−65°C to +150°C
150°C
(1) Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for
which the device is intended to be functional, but specific performance is not ensured. For ensured specifications and the test
conditions, see the Electrical Characteristics.
(2) For specified Military Temperature Range parameters see RETSMC6462/4X.
(3) If Military/Aerospace specified devices are required, please contact the Texas Instruments Sales Office/Distributors for availability and
specifications.
(4) Human body model, 1.5 kΩ in series with 100 pF. All pins rated per method 3015.6 of MIL-STD-883. This is a class 2 device rating.
(5) Limiting input pin current is only necessary for input voltages that exceed absolute maximum input voltage ratings.
(6) Applies to both single supply and split-supply operation. Continuous short circuit operation at elevated ambient temperature can result in
exceeding the maximum allowed junction temperature of 150°C. Output currents in excess of ±30 mA over long term may adversely
affect reliability.
(7) Do not short circuit output to V⁺, when V⁺ is greater than 13V or reliability will be adversely affected.
(8) The maximum power dissipation is a function of T_J(MAX), θ_JA, and T_A. The maximum allowable power dissipation at any ambient
temperature is P_D = (T_J(MAX) − T_A)/θ_JA. All numbers apply for packages soldered directly into a PC board.
Operating Ratings
Supply Voltage
Junction Temperature
Range
Thermal Resistance (θ_JA)
LMC6462AM, LMC6464AM
LMC6462AI, LMC6464AI
LMC6462BI, LMC6464BI
P Package, 8-Pin PDIP
D Package, 8-Pin SOIC
NFF Package, 14-Pin PDIP
D Package, 14-Pin SOIC
3.0V ≤ V⁺ ≤ 15.5V
−55°C ≤ T_J ≤ +125°C
−40°C ≤ T_J ≤ +85°C
−40°C ≤ T_J ≤ +85°C
115°C/W
193°C/W
81°C/W
126°C/W
(1) Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for
which the device is intended to be functional, but specific performance is not ensured. For ensured specifications and the test
conditions, see the Electrical Characteristics.
5V DC Electrical Characteristics
Unless otherwise specified, all limits ensured for T_J = 25°C, V⁺ = 5V, V^− = 0V, V_CM = V_O = V⁺/2 and R_L > 1M. Boldface limits
apply at the temperature extremes.
Symbol
Parameter
Conditions
Typ ⁽¹⁾
LMC6462AI
LMC6464AI
Limit ⁽²⁾
LMC6462BI
LMC6464BI
Limit ⁽²⁾
LMC6462AM
LMC6464AM
Limit ⁽²⁾
Units
V_OS
Input Offset Voltage
0.25
0.5
3.0
1.2
3.7
0.5
mV
1.5
max
TCV_OS
I_B
Input Offset Voltage
Average Drift
Input Current
See ⁽³⁾
1.5
μV/°C
0.15
10
10
200
pA max
(1) Typical Values represent the most likely parametric norm.
(2) All limits are specified by testing or statistical analysis.
(3) Specified limits are dictated by tester limitations and not device performance. Actual performance is reflected in the typical value.
2
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