LMC6044 Datasheet, PDF (2/23 Pages) National Semiconductor (TI) – CMOS Quad Micropower Operational Amplifier

LMC6044
SNOS612D – NOVEMBER 1994 – REVISED MARCH 2013
www.ti.com
Absolute Maximum Ratings⁽¹⁾⁽²⁾
Differential Input Voltage
Supply Voltage (V⁺ − V^−)
Output Short Circuit to V⁺
Output Short Circuit to V^−
Lead Temperature (Soldering, 10 sec.)
Current at Input Pin
Current at Output Pin
Current at Power Supply Pin
Power Dissipation
Storage Temperature Range
Junction Temperature⁽⁵⁾
ESD Tolerance⁽⁶⁾
Voltage at I/O Pin (V⁺)
±Supply Voltage
16V
See ⁽³⁾
See ⁽⁴⁾
260°C
±5 mA
±18 mA
35 mA
See ⁽⁵⁾
−65°C to +150°C
110°C
500V
+0.3V, (V^−) −0.3V
(1) Absolute Maximum Ratings indicate limts beyond which damage to the device may occur. Operating Ratings indicate conditions for
which the device is intended to be functional, but do not guarantee specific performance limits. For guaranteed specifications and test
conditions, see the Electrical Characteristics. The guaranteed specifications apply only for the test conditions listed.
(2) If Military/Aerospace specified devices are required, please contact the Texas Instruments Sales Office/Distributors for availability and
specifications.
(3) Do not connect output to V⁺ when V⁺ is greater than 13V or reliability may be adversely affected.
(4) Applies to both single-supply and split-supply operation. Continuous short circuit operation at elevated ambient temperature can result in
exceeding the maximum allowed junction temperature of 110°C. Output currents in excess of ±30 mA over long term may adversely
affect reliability.
(5) The maximum power dissipation is a function of T_J(max), θ_JA, and T_A. The maximum allowable power dissipation at any ambient
temperature is P_D = (T_J(max) − T_A)/θ_JA.
(6) Human body model, 1.5 kΩ in series with 100 pF.
Operating Ratings
Temperature Range
Thermal Resistance (θ_JA)⁽¹⁾
Power Dissipation
LMC6044AI, LMC6044I
Supply Voltage
14-Pin PDIP
14-Pin SOIC
−40°C ≤ T_J ≤ +85°C
4.5V ≤ V+ ≤ 15.5V
85°C/W
115°C/W
See ⁽²⁾
(1) All numbers apply for packages soldered directly into a PC poard.
(2) For operating at elevated temperatures, the device must be derated based on the thermal resistance θ_JA with P_D = (T_J − T_A)/θ_JA.
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