LM3875 Datasheet, PDF (2/29 Pages) National Semiconductor (TI) – OverturTM Audio Power Amplifier Series High-Performance 56W Audio Power Amplifier

LM3875
SNAS083D – JUNE 1999 – REVISED APRIL 2013
Typical Application
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*Optional components dependent upon specific design requirements. Refer to the External Components Description
section for a component function description.
Figure 1. Typical Audio Amplifier Application Circuit
Connection Diagram
Figure 2. Plastic Package⁽¹⁾ - Top View
See Package Number NDJ for
Staggered Lead Non-Isolated Package
or NDA0011B for Staggered Lead Isolated Package
(1) The LM3875T package (NDJ) is a non-isolated package, setting the tab of the device and the heat sink at V^− potential when the
LM3875 is directly mounted to the heat sink using only thermal compound. If a mica washer is used in addition to thermal compound,
θ_CS (case to sink) is increased, but the heat sink will be isolated from V^−.
2
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