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INA231_17 Datasheet, PDF (2/37 Pages) Texas Instruments – High- or Low-Side Measurement, Bidirectional CURRENT/POWER MONITOR with 1.8-V I2C Interface
INA231
SBOS644 – FEBRUARY 2013
www.ti.com
This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with
appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more
susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.
PRODUCT
INA231
PACKAGE INFORMATION(1)
PACKAGE-LEAD
PACKAGE DESIGNATOR
WCSP-12
YFF
PACKAGE MARKING
INA231
(1) For the most current package and ordering information see the Package Option Addendum at the end of this document, or see the
INA231 product folder at www.ti.com.
ABSOLUTE MAXIMUM RATINGS(1)
Over operating free-air temperature range (unless otherwise noted).
Supply voltage, VS
Analog inputs, IN+, IN–
Differential (VIN+) – (VIN–)(2)
Common-mode
SDA
SCL
Input current into any pin
Open-drain digital output current
Storage temperature
Junction temperature
Electrostatic discharge
(ESD) ratings
Human body model (HBM)
Charged-device model (CDM)
Machine model (MM)
INA231
6
–30 to +30
–0.3 to +30
GND – 0.3 to +6
GND – 0.3 to VS + 0.3
5
10
–65 to +150
+150
2500
1000
150
UNIT
V
V
V
V
V
mA
mA
°C
°C
V
V
V
(1) Stresses above these ratings may cause permanent damage. Exposure to absolute maximum conditions for extended periods may
degrade device reliability. These are stress ratings only, and functional operation of the device at these or any other conditions beyond
those specified is not implied.
(2) VIN+ and VIN– may have a differential voltage of –30 V to +30 V; however, the voltage at these pins must not exceed the range –0.3 V to
+30 V.
2
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