DRV8601 Datasheet, PDF (2/20 Pages) Texas Instruments – Haptic Driver for DC Motors (ERMs) and Linear Vibrators (LRAs) with Ultra-Fast Turn-On

DRV8601
SLOS629B – JULY 2010 – REVISED JANUARY 2012
www.ti.com
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
NAME
IN1
IN2
OUT+
OUT-
REFOUT
EN
VDD
GND
PIN
BALL (ZQV)
C3
C2
B3
A1
C1
B1
A3
B2
PIN (DRB)
4
3
5
8
2
1
6
7
Pin Functions
INPUT/OUTPUT/
POWER (I/O/P)
I
I
O
O
O
I
P
P
DESCRIPTION
Input to driver
Input to driver
Positive output
Negative output
Reference voltage output
Chip enable
Supply voltage
Ground
Device
Symbolization
ORDERING INFORMATION
MicroStar Junior™
(ZQV)
DRV8601ZQVR ^{(1) (2)}
QFN Package
(DRB)
DRV8601DRB ⁽²⁾
HSMI
8601
(1) The ZQV packages are only available taped and reeled. The suffix R
designates taped and reeled parts in quantities of 2500.
(2) For the most current package and ordering information, see the
Package Option Addendum at the end of this document or visit the
TI website at www.ti.com
THERMAL INFORMATION
THERMAL METRIC⁽¹⁾
DRV8601
ZQV (8 BALLS)
DRB (8 PINS)
UNITS
θ_JA
θ_JCtop
θ_JB
ψ_JT
ψ_JB
θ_JCbot
Junction-to-ambient thermal resistance
Junction-to-case (top) thermal resistance
Junction-to-board thermal resistance
Junction-to-top characterization parameter
Junction-to-board characterization parameter
Junction-to-case (bottom) thermal resistance
78
52.8
155
63
65
28.4
°C/W
5
2.7
50
28.6
n/a
11.4
(1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.
2
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