DRV592_12 Datasheet, PDF (2/16 Pages) Texas Instruments – +- 3-A HIGH EFFICIENCY H-BRIDGE

DRV592
SLOS390A – NOVEMBER 2001– REVISED MAY 2002
www.ti.com
This integrated circuit can be damaged by ESD. Texas
Instruments recommends that all integrated circuits be
handled with appropriate precautions. Failure to observe
proper handling and installation procedures can cause damage.
ESD damage can range from subtle performance degradation to
complete device failure. Precision integrated circuits may be more
susceptible to damage because very small parametric changes could
cause the device not to meet its published specifications.
ORDERING INFORMATION
TA
PowerPAD QUAD FLATPACK
(VFP)
–40°C to 85°C
DRV592VFP(1)
(1) _{This package is available taped and reeled. To order this}
packaging option, add an R suffix to the part number (e.g.,
DRV592VFPR).
ABSOLUTE MAXIMUM RATINGS
over operating free-air temperature range unless otherwise noted(1)
DRV591
UNIT
Supply voltage, AVDD, PVDD
–0.3 to 5.5
V
Input voltage, VI
Output current, IO (FAULT0, FAULT1)
Continuous total power dissipation
–0.3 to VDD + 0.3
V
1
mA
See Dissipation Rating Table
Operating free-air temperature range, TA
–40 to 85
°C
Operating junction temperature range, TJ
–40 to 150
°C
Storage temperature range, Tstg
–65 to 165
°C
(1) _{Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and}
functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not
implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
RECOMMENDED OPERATING CONDITIONS
ÑÑÑÑÑÑÑÑÑÑÑÑÑÑÑÑÑÑÑÑÑÑÑÑÑÑÑÑÑÑÑÑÑÑ Supply voltage, AVDD, PVDD
ÑÑÑÑÑÑÑÑÑÑÑÑÑÑÑÑÑÑÑÑÑÑÑÑÑÑÑÑÑÑÑÑÑÑ ^{High-level input voltage, VIH}
Low-level input voltage, VIL
ÑÑÑÑÑÑÑÑÑÑÑÑÑÑÑÑÑÑÑÑÑÑÑÑÑÑÑÑÑÑÑÑÑÑÑÑÑÑÑÑÑÑÑÑÑÑÑÑÑÑÑÑÑÑÑÑÑÑÑÑÑÑÑÑÑÑÑÑ _{Operating free-air temperature, TA}
SHUTDOWN, HI-Z, IN+, IN–
SHUTDOWN, HI-Z, IN+, IN–
MIN MAX UNIT
2.8 5.5 V
2
V
0.8 V
–40 85 °C
PACKAGE DISSIPATION RATINGS
PACKAGE
Θ_JA(1)
(°C/W)
Θ_JC
(°C/W)
TA = 25°C
POWER RATING
VFP
29.4
1.2
4.1 W
(1) _{This data was taken using 2 oz trace and copper pad that is}
soldered directly to a JEDEC standard 4-layer 3 in × 3 in PCB.
2