DRV421_16 Datasheet, PDF (2/44 Pages) Texas Instruments – Integrated Magnetic Fluxgate Sensor for Closed-Loop Current Sensing

DRV421
SBOS704B – MAY 2015 – REVISED MARCH 2016
www.ti.com
Table of Contents
1 Features .................................................................. 1
2 Applications ........................................................... 1
3 Description ............................................................. 1
4 Revision History..................................................... 2
5 Pin Configuration and Functions ......................... 3
6 Specifications......................................................... 4
6.1 Absolute Maximum Ratings ...................................... 4
6.2 ESD Ratings.............................................................. 4
6.3 Recommended Operating Conditions....................... 4
6.4 Thermal Information .................................................. 4
6.5 Electrical Characteristics........................................... 5
6.6 Typical Characteristics .............................................. 7
7 Detailed Description ............................................ 16
7.1 Overview ................................................................. 16
7.2 Functional Block Diagram ....................................... 16
7.3 Feature Description................................................. 17
7.4 Device Functional Modes........................................ 26
8 Application and Implementation ........................ 27
8.1 Application Information............................................ 27
8.2 Typical Application ................................................. 29
9 Power-Supply Recommendations...................... 34
9.1 Power-Supply Decoupling....................................... 34
9.2 Power-On Start Up and Brownout .......................... 34
9.3 Power Dissipation ................................................... 34
10 Layout................................................................... 35
10.1 Layout Guidelines ................................................. 35
10.2 Layout Example .................................................... 36
11 Device and Documentation Support ................. 37
11.1 Documentation Support ....................................... 37
11.2 Community Resources.......................................... 37
11.3 Trademarks ........................................................... 37
11.4 Electrostatic Discharge Caution ............................ 37
11.5 Glossary ................................................................ 37
12 Mechanical, Packaging, and Orderable
Information ........................................................... 37
4 Revision History
NOTE: Page numbers for previous revisions may differ from page numbers in the current version.
Changes from Revision A (July 2015) to Revision B
Page
• Added TI Design .................................................................................................................................................................... 1
• Added last two Applications bullets ....................................................................................................................................... 1
• Changed QFN to WQFN in pin configuration drawing .......................................................................................................... 3
• Changed QFN to WQFN in Thermal Information table ......................................................................................................... 4
• Changed QFN to WQFN in Power Dissipation section ....................................................................................................... 34
Changes from Original (May 2015) to Revision A
Page
• Released to production........................................................................................................................................................... 1
2
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