English
Language : 

DAC8801_16 Datasheet, PDF (2/22 Pages) Texas Instruments – 14-Bit, Serial Input Multiplying Digital-to-Analog Converter
DAC8801
SLAS403B – NOVEMBER 2004 – REVISED FEBRUARY 2007
www.ti.com
This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with
appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be
more susceptible to damage because very small parametric changes could cause the device not to meet its published
specifications.
PACKAGE/ORDERING INFORMATION (1)
PRODUCT
MINIMUM
RELATIVE
ACCURACY
(LSB)
DIFFERENTIAL
NONLINEARITY
(LSB)
PACKAGE-
LEAD
DAC8801
±1
±0.5
MSOP-8
PACKAGE
DESIGNATOR
DGK
DAC8801
±1
±0.5
MSOP-8
DGK
DAC8801
±1
±0.5
SON-8
DRB
DAC8801
±1
±0.5
SON-8
DRB
SPECIFIED
TEMPERATURE
RANGE
-40°C to 85°C
-40°C to 85°C
-40°C to 85°C
-40°C to 85°C
PACKAGE
MARKING
F01
F01
E01
E01
ORDERING
NUMBER
DAC8801IDGKT
DAC8801IDGKR
DAC8801IDRBT
DAC8801IDRBR
TRANSPORT
MEDIA,
QUANTITY
Tape and Reel,
250
Tape and Reel,
2500
Tape and Reel,
250
Tape and Reel,
2500
(1) For the most current package and ordering information, see the Package Option Addendum at the end of this data sheet, or refer to our
web site at www.ti.com.
ABSOLUTE MAXIMUM RATINGS(1)
over operating free-air temperature range (unless otherwise noted)
VDD to GND
Digital Input voltage to GND
VOUT to GND
Operating temperature range
VREF, RFB to GND
Storage temperature range
Junction temperature range (TJ max)
Power dissipation
Thermal impedance, RΘJA
Lead temperature, soldering
Vapor phase (60s)
Lead temperature, soldering
Infrared (15s)
ESD rating, HBM
ESD rating, CDM
DAC8801
–0.3 to 7
–0.3 to +VDD + 0.3
–0.3 to +VDD + 0.3
–40 to 105
–25 to 25
–65 to 150
125
(TJ max – TA) / RΘJA
55
215
220
4000
1000
UNITS
V
V
V
°C
V
°C
°C
W
°C/W
°C
°C
V
V
(1) Stresses above those listed under Absolute Maximum Ratings may cause permanent damage to the device. Exposure to absolute
maximum conditions for extended periods may affect device reliability.
2
Submit Documentation Feedback