ADS8864_14 Datasheet, PDF (2/46 Pages) Texas Instruments – 16-Bit, 400-kSPS, Serial Interface, microPower, Miniature, Single-Ended Input, SAR Analog-to-Digital Converter

ADS8864
SBAS572A – MAY 2013 – REVISED DECEMBER 2013
www.ti.com
This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with
appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more
susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.
THROUGHPUT
100 kSPS
250 kSPS
400 kSPS
500 kSPS
680 kSPS
1 MSPS
FAMILY INFORMATION⁽¹⁾
18-BIT, TRUE-DIFFERENTIAL
16-BIT, SINGLE-ENDED
ADS8887
ADS8866
—
—
ADS8885
—
ADS8864
ADS8319 ⁽²⁾
ADS8883
ADS8862
ADS8881
ADS8860
16-BIT, TRUE-DIFFERENTIAL
ADS8867
—
ADS8865
ADS8318 ⁽²⁾
ADS8863
ADS8861
(1) For the most current package and ordering information, see the Package Option Addendum at the end of this document, or visit the
device product folder at www.ti.com.
(2) Pin-to-pin compatible device with AVDD = 5 V.
ABSOLUTE MAXIMUM RATINGS⁽¹⁾
Over operating free-air temperature range, unless otherwise noted.
VALUE
MIN
MAX
UNIT
AINP to GND or AINN to GND
–0.3
REF + 0.3
V
AVDD to GND or DVDD to GND
–0.3
4
V
REF to GND
–0.3
5.7
V
Digital input voltage to GND
–0.3
DVDD + 0.3
V
Digital output to GND
–0.3
DVDD + 0.3
V
Operating temperature range, T_A
Storage temperature range, T_stg
–40
+85
°C
–65
+150
°C
(1) Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under electrical characteristics is not
implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
THERMAL INFORMATION
THERMAL METRIC⁽¹⁾
ADS8864
DGS
DRC
UNITS
10 PINS
10 PINS
θ_JA
θ_JCtop
θ_JB
ψ_JT
ψ_JB
θ_JCbot
Junction-to-ambient thermal resistance
Junction-to-case (top) thermal resistance
Junction-to-board thermal resistance
Junction-to-top characterization parameter
Junction-to-board characterization parameter
Junction-to-case (bottom) thermal resistance
151.9
45.4
72.2
3.3
70.9
N/A
111.1
46.4
45.9
3.5
45.5
N/A
°C/W
(1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.
2
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