ADS8365_14 Datasheet, PDF (2/38 Pages) Texas Instruments – 16-Bit, 250kSPS, 6-Channel, Simultaneous Sampling SAR ANALOG-TO-DIGITAL CONVERTERS

ADS8365
SBAS362C – AUGUST 2006 – REVISED MARCH 2008.................................................................................................................................................... www.ti.com
This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with
appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more
susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.
ORDERING INFORMATION⁽¹⁾
PRODUCT
MAXIMUM
INTEGRAL
LINEARITY
ERROR
(LSB)
NO
MISSING
CODES
ERROR
(LSB)
PACKAGE-
LEAD
PACKAGE
DESIGNATOR
SPECIFIED
TEMPERATURE
RANGE
PACKAGE
MARKING
ADS8365
±4
14
TQFP-64
PAG
–40°C to +85°C ADS8365AI
ORDERING
NUMBER
ADS8365IPAG
ADS8365IPAGR
TRANSPORT
MEDIA,
QUANTITY
Tray, 160
Tape and
Reel, 1500
(1) For the most current package and ordering information, see the Package Option Addendum located at the end of this data sheet, or see
the TI website at www.ti.com.
ABSOLUTE MAXIMUM RATINGS⁽¹⁾
over operating free-air temperature range (unless otherwise noted)
Supply voltage, AGND to AV_DD
Supply voltage, BGND to BV_DD
Analog input voltage range
Reference input voltage range
Digital input voltage range
Ground voltage differences, AGND to BGND
Voltage differences, BV_DD to AGND
Input current to any pin except supply
Power dissipation
Operating virtual junction temperature range, T_J
Operating free-air temperature range, T_A
Storage temperature range, T_STG
ADS8365
–0.3 to 6
–0.3 to 6
AGND – 0.3 to AV_DD + 0.3
AGND – 0.3 to AV_DD + 0.3
BGND – 0.3 to BV_DD + 0.3
±0.3
–0.3 to 6
–20 to 20
See Dissipation Ratings Table
–40 to +150
–40 to +85
–65 to +150
UNIT
V
V
V
V
V
V
V
mA
°C
°C
°C
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating
Conditions is not implied. Exposure to absolute-maximum rated conditions for extended periods may affect device reliability.
DISSIPATION RATINGS
BOARD
Low-K ⁽¹⁾
High-K ⁽²⁾
PACKAGE
PAG
PAG
R_θJC
8.6°C/W
8.6°C/W
R_θJA
68.5°C/W
42.8°C/W
DERATING
FACTOR ABOVE
T_A = +25°C
14.598mW/°C
23.364mW/°C
T_A ≤ +25°C
POWER RATING
1824mW
2920mW
T_A = +70°C
POWER RATING
1168mW
1869mW
T_A = +85°C
POWER RATING
949mW
1519mW
(1) The JEDEC Low K (1s) board design used to derive this data was a 3-inch x 3-inch, two-layer board with 2-ounce copper traces on top
of the board.
(2) The JEDEC High K (2s2p) board design used to derive this data was a 3-inch x 3-inch, multilayer board with 1-ounce internal power and
ground planes, and 2-ounce copper traces on the top and bottom of the board.
2
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