TIBPAL16L8-15C_15 Datasheet, PDF (19/24 Pages) Texas Instruments – HIGH-PERFFORMANCE IMPACT

PACKAGE OPTION ADDENDUM
www.ti.com
17-Dec-2015
Orderable Device
TIBPAL16R6-20MFKB
Status
(1)
NRND
Package Type Package Pins Package
Drawing
Qty
LCCC
FK
20
1
Eco Plan
(2)
TBD
Lead/Ball Finish
(6)
POST-PLATE
MSL Peak Temp
(3)
N / A for Pkg Type
Op Temp (°C)
-55 to 125
TIBPAL16R6-20MJB
TIBPAL16R6-20MWB
TIBPAL16R8-20MFKB
NRND
CDIP
NRND
CFP
NRND
LCCC
J
20
1
W
20
1
FK
20
1
TBD
TBD
TBD
A42
A42
POST-PLATE
N / A for Pkg Type -55 to 125
N / A for Pkg Type -55 to 125
N / A for Pkg Type -55 to 125
TIBPAL16R8-20MJ
TIBPAL16R8-20MJB
OBSOLETE CDIP
NRND
CDIP
J
20
J
20
1
TBD
TBD
Call TI
A42
Call TI
N / A for Pkg Type
-55 to 125
-55 to 125
(1) _{The marketing status values are defined as follows:}
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
Device Marking
(4/5)
5962-
85155032A
TIBPAL16
R6-20MFKB
5962-8515503RA
TIBPAL16R6-20M
JB
5962-8515503SA
TIBPAL16R6-20M
WB
5962-
85155022A
TIBPAL16
R8-20MFKB
TIBPAL16R8-20M
J
5962-8515502RA
TIBPAL16R8-20M
JB
(2) _{Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability}
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3) _{MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.}
Samples
Addendum-Page 3