TPA6120A2 Datasheet, PDF (18/31 Pages) Texas Instruments – HIGH FIDELITY HEADPHONE AMPLIFIER

TPA6120A2
SLOS431B – MARCH 2004 – REVISED FEBRUARY 2015
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12.2 Layout Example
This is part of a 4-layer board, where ground, V+, V- are on the bottom and two middle traces, respectively. Key
items to note in this layout:
1. R4 and R3 are the output resistors in the schematic. They are sized as 0603 surface mount resistors instead
of 0402 for their thermal capacity, as they will be dissipating heat, depending on the output power.
2. Traces are kept as short as possible to avoid any capacitance or oscillation issues.
3. In systems that may be using the DWP package with through hole resistors, it's strongly suggested that the
input and output pins and components do not have a ground plane directly beneath them, to avoid stray
capacitance.
Figure 23. PCB Layout Example
Figure 24. Example PCB Layout, Top Layer and
Silkscreen, Top View
Figure 25. Example PCB Layout, Middle-1 Layer
and Silkscreen, Top View
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