CC2538_15 Datasheet, PDF (18/33 Pages) Texas Instruments – Powerful Wireless Microcontroller System-On-Chip

CC2538
SWRS096D – DECEMBER 2012 – REVISED APRIL 2015
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5.20 Thermal Resistance Characteristics for RTQ Package
NAME
Rθ_JC-top
Rθ_JB
Rθ_JA
Psi_JT
Psi_JB-bottom
DESCRIPTION
Junction-to-case (top)
Junction-to-board
Junction-to-free air
Junction-to-package top
Junction-to-board (bottom)
°C/W ^{(1) (2)}
8.9
3.1
25.0
3.1
0.4
AIR FLOW (m/s)⁽³⁾
0.00
0.00
0.00
0.00
0.00
(1) °C/W = degrees Celsius per watt.
(2) These values are based on a JEDEC-defined 2S2P system (with the exception of the Theta JC [Rθ_JC] value, which is based on a
JEDEC-defined 1S0P system) and will change based on environment as well as application. For more information, see these
EIA/JEDEC standards:
• JESD51-2, Integrated Circuits Thermal Test Method Environmental Conditions - Natural Convection (Still Air)
• JESD51-3, Low Effective Thermal Conductivity Test Board for Leaded Surface Mount Packages
• JESD51-7, High Effective Thermal Conductivity Test Board for Leaded Surface Mount Packages
• JESD51-9, Test Boards for Area Array Surface Mount Package Thermal Measurements
(3) m/s = meters per second.
18
Specifications
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